Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.

Abstract: A method for performing network control in a wireless communications system and associated apparatus are provided. The method may include: carrying a set of link information in a preamble of a first data transmission frame transmitted from the first network device to a second network device, wherein the set of link information may include at least one indication among the following indications: a destination device indication, a device assignment indication and a transmission power control indication; wherein a third network device is arranged to monitor wireless transmission in the wireless communications system to obtain the set of link information from the first data transmission frame, and determine spatial reuse (SR) transmission availability of the third network device based on the set of link information.

Abstract: A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. An opening is formed in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The opening is then filled with an organic material.

Abstract: A method of treating a condition related to iron deficiency. The method includes steps of identifying a patient having a condition related to iron deficiency and administering an effective amount of biocompatible iron oxide nanoparticles to the patient. The biocompatible iron oxide nanoparticles each contains an iron oxide core that is covered by one or more biocompatible polymers, each of which has a polyethylene glycol group, a silane group, and a linker linking, via a covalent bond, the polyethylene glycol group and the silane group.

Abstract: A method of treating a condition related to iron deficiency. The method includes steps of identifying a patient having a condition related to iron deficiency and administering an effective amount of biocompatible iron oxide nanoparticles to the patient. The biocompatible iron oxide nanoparticles each contains an iron oxide core that is covered by one or more biocompatible polymers, each of which has a polyethylene glycol group, a silane group, and a linker linking, via a covalent bond, the polyethylene glycol group and the silane group.

Abstract: A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. An opening is formed in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The opening is then filled with an organic material.

Abstract: A method of fabricating a semiconductor image sensor device is disclosed. A plurality of radiation-sensing regions is formed in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. An opening is formed in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The opening is then filled with an organic material.

Abstract: Provided is a semiconductor image sensor device that includes a non-scribe-line region and a scribe-line region. The image sensor device includes a first substrate portion disposed in the non-scribe-line region. The first substrate portion contains a doped radiation-sensing region. The image sensor device includes a second substrate portion disposed in the scribe-line region. The second substrate portion has the same material composition as the first substrate portion. Also provided is a method of fabricating an image sensor device. The method includes forming a plurality of radiation-sensing regions in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. The method includes forming an opening in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The method includes filling the opening with an organic material.

Abstract: Provided is a semiconductor image sensor device that includes a non-scribe-line region and a scribe-line region. The image sensor device includes a first substrate portion disposed in the non-scribe-line region. The first substrate portion contains a doped radiation-sensing region. The image sensor device includes a second substrate portion disposed in the scribe-line region. The second substrate portion has the same material composition as the first substrate portion. Also provided is a method of fabricating an image sensor device. The method includes forming a plurality of radiation-sensing regions in a substrate. The radiation-sensing regions are formed in a non-scribe-line region of the image sensor device. The method includes forming an opening in a scribe-line region of the image sensor device by etching the substrate in the scribe-line region. A portion of the substrate remains in the scribe-line region after the etching. The method includes filling the opening with an organic material.

Abstract: This invention discloses a method for mining a comment term in a document. The method comprises, first, to build a document database and a keyword database, wherein the document database includes at least one digital document, the keyword database includes at least one keyword. Then, a language of the digital document is determined. The digital document is processed based on the language to form a first document. Next, word groups are gathered from the first document based on a gathering range and apart-of-speech, wherein each word group includes the keyword and a word with the part-of-speech.

Abstract: The present invention includes a method, apparatus and graphical user interface (GUI) that allows a simple, precise, thorough, automatic and interactive diagnostic system for electronic devices. The present invention fully automates every test item, as a memory device including the diagnostic test items is inserted into the electronic device and is configured to automatically begin the diagnostic method. The present invention allows for interactive diagnostic analysis and a user is able to automatically repair many of the defects detected by the diagnostic method.

Abstract: The present invention includes a method, apparatus and graphical user interface (GUI) that allows a simple, precise, thorough, automatic and interactive diagnostic system for electronic devices. The present invention fully automates every test item, as a memory device including the diagnostic test items is inserted into the electronic device and is configured to automatically begin the diagnostic method. The present invention allows for interactive diagnostic analysis and a user is able to automatically repair many of the defects detected by the diagnostic method.

Abstract: The present invention includes a method, apparatus and graphical user interface (GUI) that allows a simple, precise, thorough, automatic and interactive diagnostic system for electronic devices. The present invention fully automates every test item, as a memory device including the diagnostic test items is inserted into the electronic device and is configured to automatically begin the diagnostic method. The present invention allows for interactive diagnostic analysis and a user is able to automatically repair many of the defects detected by the diagnostic method.