Patents by Inventor Hsin-Jung Liu

Hsin-Jung Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9966263
    Abstract: A method of fabricating fin structure is provided. A patterned catalyst layer and a patterned passivation layer extending along a first direction are formed on a substrate. The patterned passivation layer is located on the patterned catalyst layer. A carbon layer is formed on at least one side of the patterned catalyst layer and includes hollow carbon tubes arranged along the first direction. Each hollow carbon tube extends along a second direction. A removal process is performed to remove the top and a portion of the bottom of each hollow carbon tube closest to the substrate, so that remnants are left and serve as a mask layer. Two adjacent remnants form a stripe pattern extending along the second direction. The patterned passivation layer and the patterned catalyst layer are removed. The pattern of the mask layer is transferred to the substrate to form fin structures. The mask layer is removed.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: May 8, 2018
    Assignee: United Microelectronics Corp.
    Inventors: Kun-Ju Li, Li-Chieh Hsu, Yi-Han Liao, Chun-Tsen Lu, Chih-Hsun Lin, Hsin-Jung Liu
  • Patent number: 9735015
    Abstract: A method of manufacturing a semiconductor structure, comprising: providing a preliminary structure having a first region and a second region and comprising a plurality of first trenches in the first region; forming a metal layer filling the first trenches covering on the preliminary structure, wherein the metal layer comprises a concave portion in the second region and the concave portion defines an opening; forming a metal nitride layer on the metal layer by an nitride treatment; and performing a planarization process to remove the metal nitride layer and a portion of the metal layer to expose the preliminary structure.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: August 15, 2017
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Kun Ju Li, Hsin Jung Liu, Wei-Chuan Tsai, Min-Chuan Tsai, Yi Han Liao, Chun-Tsen Lu, Chun-Lin Chen, Jui-Ming Yang, Kuo-Chin Hung
  • Publication number: 20060211554
    Abstract: A tool magazine assembly for a machining center holds multiple tool holders and has an outer ring, an inner ring and multiple brackets. The inner ring is mounted in but does not contact the outer ring and has multiple through holes. The brackets are attached to the inner ring, and each bracket has multiple through holes, a central hole, multiple fastening holes, multiple bolts and a central bolt. The bolts extend through the through holes to attach the brackets to the inner ring. The central bolts extend through the central holes between the inner ring and the outer ring. Each tool holder has multiple bolts. The bolts extend through the fastening holes to attach the tool holders to the brackets.
    Type: Application
    Filed: March 18, 2005
    Publication date: September 21, 2006
    Inventor: Hsin-Jung Liu