Abstract: In embodiments of the present disclosure, a vibrator is used to generate a vibration wave with a variable frequency that can agitate and facilitate the circulation of the processing fluids, thereby enhancing the uniformity and efficiency of the resulting semiconductor device features, the vibrator may be a piezoelectric vibrator or other similar vibrators. In some embodiments, the vibration of the processing fluids can facilitate the processing fluids in circulating in and out of narrow channels or features, or the vibration of the processing fluids can facilitate the bubbling out of the microbubbles entrapped in the processing liquid or entrapped between the surface of the semiconductor wafer and the processing liquid. In another embodiment, the vibrations generated by the vibrator have vibration waves with a variable frequency to avoid resonance that may damage the semiconductor wafer and the features thereon.

Abstract: The present disclosure provides a method of cleaning a semiconductor wafer during a process of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side, wherein alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system. The disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface thereof. The predetermined region of the wafer at least partially overlaps with one or more alignment marks.

Abstract: The present disclosure provides a method of cleaning a semiconductor wafer during a process of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side, wherein alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system. The disclosure also provides an apparatus for fabricating a semiconductor device. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface thereof. The predetermined region of the wafer at least partially overlaps with one or more alignment marks.

Abstract: In embodiments of the present disclosure, a vibrator is used to generate a vibration wave with a variable frequency that can agitate and facilitate the circulation of the processing fluids, thereby enhancing the uniformity and efficiency of the resulting semiconductor device features, the vibrator may be a piezoelectric vibrator or other similar vibrators. In some embodiments, the vibration of the processing fluids can facilitate the processing fluids in circulating in and out of narrow channels or features, or the vibration of the processing fluids can facilitate the bubbling out of the microbubbles entrapped in the processing liquid or entrapped between the surface of the semiconductor wafer and the processing liquid. In another embodiment, the vibrations generated by the vibrator have vibration waves with a variable frequency to avoid resonance that may damage the semiconductor wafer and the features thereon.

Abstract: A light source includes a plurality of ultraviolet (UV) light emitting diodes (LEDs) and an LED phase shift controller coupled to the plurality of UV LEDs adapted to control the phase shift of each UV LED in the plurality of UV LEDs. The plurality of UV LEDs forms a UV LED array. An ultraviolet lithography system can include a light source as described above. The system can further include a mirror assembly in a light path of the light source, the mirror assembly having a polarization mirror with an interference coating. A method provides a light source for an ultraviolet lithography system including the element of providing an plurality of UV LEDs that emit UV light and the element of controlling a phase shift of the plurality of UV LEDs with an LED phase shift controller coupled to each UV LED or arrays of the UV LEDs in the plurality of UV LEDs.

Abstract: A light source includes a plurality of ultraviolet (UV) light emitting diodes (LEDs) and an LED phase shift controller coupled to the plurality of UV LEDs adapted to control the phase shift of each UV LED in the plurality of UV LEDs. The plurality of UV LEDs forms a UV LED array. An ultraviolet lithography system can include a light source as described above. The system can further include a mirror assembly in a light path of the light source, the mirror assembly having a polarization mirror with an interference coating. A method provides a light source for an ultraviolet lithography system including the element of providing an plurality of UV LEDs that emit UV light and the element of controlling a phase shift of the plurality of UV LEDs with an LED phase shift controller coupled to each UV LED or arrays of the UV LEDs in the plurality of UV LEDs.

Abstract: The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a mechanical structure that is operable to secure a position of a semiconductor wafer. The wafer has a front surface and a back surface. The apparatus includes a wafer cleaning device that is operable to clean a predetermined region of the wafer on the back surface. The predetermined region of the wafer at least partially overlaps with one or more alignment marks. The present disclosure also provides a method of fabricating a semiconductor device. The method includes loading a semiconductor wafer into a wafer handling system. The method includes removing contaminant particles from an edge region of the wafer from the back side. The alignment marks are located in the edge region. The method includes collecting the removed contaminant particles and discarding the collected contaminant particles out of the wafer handling system.

Abstract: A direct backlight module and liquid crystal display utilizing the same. The direct backlight module comprises a reflector, at least one light source, and a plurality of transparent supports. The reflector has an opening, and the light source is disposed parallel to the reflector. The transparent supports are disposed at each end of the light source to secure the light source. Thus, light emitted from the light source can be reflected by the reflector.

Abstract: A backlight module and a liquid crystal display utilizing the same. The backlight module has a heat-dissipating port and a thermally actuated device disposed therein. When the temperature inside the backlight module exceeds a predetermined limit, the thermally actuated device starts to open the heat-dissipating port. When the temperature inside the backlight module drops below the predetermined limit, the thermally actuated device closes the heat-dissipating port. The extent of the port controlled by the thermally actuated device varies with the temperature inside the backlight module.