Patents by Inventor Hsin Kuo Dai

Hsin Kuo Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6278345
    Abstract: A flexible printed circuit comprises a flexible insulative board having a first surface and a second surface opposite thereto. At least one conductive transmission line is formed on the first surface and comprises same length of a plurality of tested sections. Each tested section has an original characteristic impedance and the original characteristic impedance of each tested sections is beyond an acceptable tolerance to a standard value. A compensation region is defined at the second surface and separated into a plurality of compensation units having identical area. Each compensation unit is vertically related to a specific tested section of the at least one transmission line and having a conductive region and a non-conductive region. A final characteristic impedance of the tested section is obtained within an acceptable tolerance to the standard value due to compensation of the compensation unit.
    Type: Grant
    Filed: August 12, 1999
    Date of Patent: August 21, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Hsin-Kuo Dai