Patents by Inventor Hsin-Le Lee

Hsin-Le Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7901244
    Abstract: This invention discloses a stacked electrical connector including a first connector, a second connector, and a conductive casing. The first connector includes a first signal connection portion and a first group of soldering pins extending along a direction. The second connector includes a second signal connection portion and a second group of soldering pins extending along the direction. The first connector is stacked on the second connector. The conductive casing has a first opening, a second opening, and a third opening. The conductive casing covers the first connector and the second connector. The first signal connection portion passes through the first opening, and the second signal connection portion passes through the second opening. The first group of soldering pins and the second group of soldering pins are exposed to the third opening.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: March 8, 2011
    Assignee: Pegatron Corporation
    Inventors: Hsin-Le Lee, Hao-Tser Tsai, Ruei-Chin Wu, Shr-Da Mai
  • Publication number: 20100035466
    Abstract: This invention discloses a stacked electrical connector including a first connector, a second connector, and a conductive casing. The first connector includes a first signal connection portion and a first group of soldering pins extending along a direction. The second connector includes a second signal connection portion and a second group of soldering pins extending along the direction. The first connector is stacked on the second connector. The conductive casing has a first opening, a second opening, and a third opening. The conductive casing covers the first connector and the second connector. The first signal connection portion passes through the first opening, and the second signal connection portion passes through the second opening. The first group of soldering pins and the second group of soldering pins are exposed to the third opening.
    Type: Application
    Filed: August 5, 2009
    Publication date: February 11, 2010
    Applicant: Pegatron Corporation
    Inventors: Hsin Le Lee, Hao Tser Tsai, Ruei Chin Wu, Shr Da Mai