Patents by Inventor Hsin Lee

Hsin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966170
    Abstract: A method includes receiving a wafer, measuring a surface topography of the wafer; calculating a topographical variation based on the surface topography measurement performing a single-zone alignment compensation when the topographical variation is less than a predetermined value or performing a multi-zone alignment compensation when the topographical variation is greater than the predetermined value; and performing a wafer alignment according to the single-zone alignment compensation or the multi-zone alignment compensation.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ai-Jen Hung, Yung-Yao Lee, Heng-Hsin Liu, Chin-Chen Wang, Ying Ying Wang
  • Publication number: 20240129766
    Abstract: A throttle control method for a mobile device include collecting input data, generating a first set of user experience indices according to the input data, and checking whether a user experience index of the first set of user experience indices satisfies a UEI threshold. The input data includes common information data, current configuration data and a plurality of throttle control parameters. Each user experience index of the first set of user experience indices is corresponding to at least one of throttle control parameter of the plurality of throttle control parameters.
    Type: Application
    Filed: April 10, 2023
    Publication date: April 18, 2024
    Applicant: MediaTek Singapore Pte. Ltd.
    Inventors: Hung-Yueh Chen, Byeng Hyun Kim, JUNG SHUP SHIN, Shih-Hsin Chen, Chih-Chieh Lai, Chung-Pi Lee, JUNGWOO LEE, Yu-Lun Chang
  • Publication number: 20240122226
    Abstract: A 3D food printer includes a printer head including, an extrusion nozzle and a laser assembly with at least one laser, and a heated printing platform. The extrusion nozzle is configured to extrude food onto the printing platform, and each of the printing platform and the at least one laser are configured to heat food extruded onto the printing platform.
    Type: Application
    Filed: September 12, 2023
    Publication date: April 18, 2024
    Inventors: Guijun LI, Kong Wai LEE, Yang XU, Qiaoyaxiao YUAN, Cynthia Hsin-tsing MU
  • Publication number: 20240124715
    Abstract: A biomass treatment method includes steps as follows. A biomass and sodium percarbonate are provided, wherein the biomass includes hemicellulose, cellulose and/or lignin. The biomass and the sodium percarbonate are mixed.
    Type: Application
    Filed: March 7, 2023
    Publication date: April 18, 2024
    Applicant: National Cheng Kung University
    Inventors: Wei-Hsin Chen, Kuan-Ting Lee
  • Publication number: 20240124844
    Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 18, 2024
    Inventors: Chia-Hsin Lee, Po-Cheng Lin, Yong-Cheng Kao, Ming-Hsi Chuang, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240120325
    Abstract: A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to the upper redistribution layer. The upper molding layer is disposed on the first chip and the upper redistribution layer, and is configured to package the first chip. The upper molding layer includes a recess, the recess is recessed relative to a surface of the upper molding layer away from the upper redistribution layer, and the recess is circumferentially formed around a periphery of the upper molding layer.
    Type: Application
    Filed: May 31, 2023
    Publication date: April 11, 2024
    Applicant: POWERTECH TECHNOLOGY INC.
    Inventors: Pei-chun TSAI, Hung-hsin HSU, Shang-yu CHANG CHIEN, Chia-ling LEE
  • Publication number: 20240117314
    Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 11, 2024
    Inventors: Ruei-Yue Liang, Chia-Hsin Lee, Kai-Ling Zhang, Po-Cheng Lin, Ming-Hsi Chuang, Yu-Chen Tsai, Peggy Leh Jiunn Wong
  • Publication number: 20240120288
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Hsin LAI, Chih-Cheng LEE, Shao-Lun YANG, Wei-Chih CHO
  • Patent number: 11953372
    Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: April 9, 2024
    Assignee: InnoLux Corporation
    Inventors: Yu-Tsung Liu, Wei-Ju Liao, Wei-Lin Wan, Cheng-Hsueh Hsieh, Po-Hsin Lin, Te-Yu Lee
  • Publication number: 20240113188
    Abstract: An integrated circuit (IC) structure includes a semiconductor substrate, a first gate line, a second gate line, and a first auxiliary gate portion. The semiconductor substrate comprises a semiconductor fin. The semiconductor fin extends substantially along a first direction. The first gate line and the second gate line extend substantially along a second direction different form the first direction from a top view. The first auxiliary gate portion connects the first gate line to the second gate line from the top view.
    Type: Application
    Filed: March 27, 2023
    Publication date: April 4, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen-Li CHIU, Yi-Juei LEE, Yu-Jie YE, Chi-Hsin CHANG, Chun-Jun LIN
  • Patent number: 11945877
    Abstract: Antibodies, antigen-binding fragments and polypeptides that bind to HER2 are disclosed, as well as nucleic acids and vectors encoding the same. Also provided are cells comprising the antibodies, antigen-binding fragments, polypeptides, nucleic acids and vectors, methods of making such molecules, and the use of such molecules for therapeutic applications.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: April 2, 2024
    Assignee: Agency for Science, Technology and Research
    Inventors: Cheng-I Wang, Lionel Jianrong Low, Angeline Goh, Sandy Wen-Hsin Lee
  • Patent number: 11946569
    Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: April 2, 2024
    Assignee: MICROJET TECHNOLOGY CO., LTD.
    Inventors: Hao-Jan Mou, Shih-Chang Chen, Jia-Yu Liao, Hung-Hsin Liao, Chung-Wei Kao, Chi-Feng Huang, Yung-Lung Han, Chang-Yen Tsai, Wei-Ming Lee
  • Publication number: 20240097034
    Abstract: A field effect transistor includes a substrate comprising a fin structure. The field effect transistor further includes an isolation structure in the substrate. The field effect transistor further includes a source/drain (S/D) recess cavity below a top surface of the substrate. The S/D recess cavity is between the fin structure and the isolation structure. The field effect transistor further includes a strained structure in the S/D recess cavity. The strain structure includes a lower portion. The lower portion includes a first strained layer, wherein the first strained layer is in direct contact with the isolation structure, and a dielectric layer, wherein the dielectric layer is in direct contact with the substrate, and the first strained layer is in direct contact with the dielectric layer. The strained structure further includes an upper portion comprising a second strained layer overlying the first strained layer.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Tsung-Lin Lee, Chih-Hao Chang, Chih-Hsin Ko, Feng Yuan, Jeff J. Xu
  • Publication number: 20240088042
    Abstract: A semiconductor structure includes a dielectric layer over a substrate, a via conductor over the substrate and in the dielectric layer, and a first graphene layer disposed over the via conductor. In some embodiments, a top surface of the via conductor and a top surface of the dielectric layer are level. In some embodiments, the first graphene layer overlaps the via conductor from a top view. In some embodiments, the semiconductor structure further includes a second graphene layer under the via conductor and a third graphene layer between the dielectric layer and the via conductor. In some embodiments, the second graphene layer is between the substrate and the via conductor.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Inventors: SHU-WEI LI, HAN-TANG HUNG, YU-CHEN CHAN, CHIEN-HSIN HO, SHIN-YI YANG, MING-HAN LEE, SHAU-LIN SHUE
  • Patent number: 11929216
    Abstract: A button mechanism includes a button, a module, and a thin sheet spring. The thin sheet spring is in physical communication with the button and with the module. The thin sheet spring exerts a tension force on the button and the module to bias the button toward a normal position. In response to a force greater than the tension force being exerted on the button, a portion of the thin sheet stretches to enable the button to be placed in a contact position. In response to the force being removed from the button, the tension force causes the thin sheet to snap back to an original position and biases the button toward the normal position.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: March 12, 2024
    Assignee: Dell Products L.P.
    Inventors: Minghao Hsieh, Chia-Chen Lin, Jer-Yo Lee, Po-Fei Tsai, Chang-Hsin Chen
  • Patent number: 11929391
    Abstract: Described herein is an electronic component that may include a substrate, wherein the substrate may include at least two electrodes, wherein the at least two electrodes are each spaced apart from each other on and/or within the substrate. When the electronic component is in a first operating state, an electrolytic material may be disposed at least in a spatial region between the at least two electrodes, wherein the electrolytic material comprises at least one polymerizable material. When the electronic device is in a second operating state, at least one electrical connection may be made between the at least two electrodes, wherein the at least one electrical connection comprises an electrically conductive polymer. The electrically conductive polymer may comprise one or more fiber structures, wherein the one or more fiber structures are in physical contact with the at least two electrodes.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: March 12, 2024
    Assignee: Technische Universitat Dresden
    Inventors: Hans Kleemann, Matteo Cucchi, Karl Leo, Veronika Scholz, Hsin Tseng, Alexander Lee
  • Patent number: 11929767
    Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 12, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
  • Publication number: 20240075071
    Abstract: Disclosed in the present invention is an optimized cell transplant. The optimized cell transplant is formed by performing gene induction and modification on a mesenchymal stem cell in the form of a small molecule and protein composition. The expression levels of CD200 gene, Galectin-9 gene and VISTA gene can be increased synchronously after cell culture. Vector virus infection and plasmid transfection are not required in the cell preparation process, so that high biological safety and great clinical application value of cells are achieved.
    Type: Application
    Filed: November 23, 2022
    Publication date: March 7, 2024
    Inventors: Ruei-Yue Liang, Kai-Ling Zhang, Ming-Hsi Chuang, Po-Cheng Lin, Peggy Leh Jiunn Wong, Chia-Hsin Lee
  • Publication number: 20240071428
    Abstract: A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hua-Hsin YU, Hung-Jen LIAO, Cheng-Hung LEE, Hau-Tai SHIEH