Abstract: In a mobile cellular network, a mobile network operator (MNO) or other entity can specify whether a user equipment (UE) is to utilize either a concealed identifier (e.g., a subscription concealed identifier (SUCI)) calculated by a universal subscriber identity module (USIM) of a universal integrated circuit card (UICC) or a concealed identifier calculated by mobile equipment (ME) of the UE that is separate from the UICC and USIM. In the event that a USIM-calculated concealed identifier is specified for use but the USIM fails in generation of a concealed identifier, the UE can utilize one or more failure recovery procedures to attempt completion of attachment of the UE to the same network or a different network to help ensure that the UE does not remain attached to a network without access to services of the network due to authentication failure.

Abstract: An audio output device includes a processor, an audio decoder, an audio amplifier, and a protection circuit. The processor outputs an audio digital signal. The audio decoder converts the audio digital signal into an audio analog signal. The audio amplifier amplifies the audio analog signal. The protection circuit detects abnormalities in the audio digital signal or the amplified audio analog signal. When the audio digital signal or the amplified audio analog signal is abnormal, the protection circuit outputs a disable signal to turn off or mute the audio amplifier, or the protection circuit outputs a logic signal to notify the processor, so that the processor outputs the disable signal to turn off or mute the audio amplifier.

Abstract: A touch display panel is provided. The touch display panel includes: a display panel, a touch glass, and a touch controller. The display panel includes sensing lines and identification pins. The touch controller obtains first product information of the touch glass. The touch controller and the display panel respectively report the first product information of the touch glass and second product information of the display panel to a host. The host retrieves firmware and a default noise offset value corresponding to the touch display panel according to the first product information and the second product information, and writes the firmware and default noise offset value to a non-volatile memory of the touch display panel. The touch controller executes the firmware, and determines touch actions performed on the touch glass according to the default noise offset value.

Abstract: A touch display panel is provided. The touch display panel includes: a display panel, a touch glass, and a touch controller. The display panel includes sensing lines and identification pins. The touch controller obtains first product information of the touch glass. The touch controller and the display panel respectively report the first product information of the touch glass and second product information of the display panel to a host. The host retrieves firmware and a default noise offset value corresponding to the touch display panel according to the first product information and the second product information, and writes the firmware and default noise offset value to a non-volatile memory of the touch display panel. The touch controller executes the firmware, and determines touch actions performed on the touch glass according to the default noise offset value.

Abstract: An illuminance calibrating device includes a reference light source and an illuminance detection device. The reference light source, which generates light with a specific wavelength and a source illuminance, adjusts the source illuminance to be a first illuminance according to a control signal. The illuminance detection device includes a shading plate, an illuminance detector, and a controller. The shading plate is configured to lower the first illuminance to a first shading illuminance. The illuminance detector detects the first shading illuminance to generate a detection signal. The controller generates the control signal and calculates a ratio of the first illuminance to the first shading illuminance according to the detection signal.

Abstract: An illuminance calibrating device includes a reference light source and an illuminance detection device. The reference light source, which generates light with a specific wavelength and a source illuminance, adjusts the source illuminance to be a first illuminance according to a control signal. The illuminance detection device includes a shading plate, an illuminance detector, and a controller. The shading plate is configured to lower the first illuminance to a first shading illuminance. The illuminance detector detects the first shading illuminance to generate a detection signal. The controller generates the control signal and calculates a ratio of the first illuminance to the first shading illuminance according to the detection signal.

Abstract: An integrated packaging structure is provided. In the package structure, an integrated component body has a first source region, a second source region, a first setting region, and a second setting region, which are separated from each other. A first MOSFET die and a second MOSFET die are located on the first setting region and the second setting region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed from the top surface and spaced apart from each other. A first source connection element is connected to the source electrode pad of the first MOSFET die and the first source region. A second source connection element is connected to the source electrode pad of the second MOSFET die and the second source region. A gate connection element is connected to the gate electrode pad and a gate region of the integrated component body.

Abstract: A common-source type package structure is provided in the present invention. In the package structure, an integrated component body is configured a common-source pin region, a first arrangement region and a second arrangement region. The second and first arrangement regions are spaced apart from each other. A first MOSFET die and a second MOSFET are respectively located at the first and second arrangement region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed to the top surface and spaced apart from each other. A common-source connection element is connected to the source electrode pad and the common-source pin region. A gate connection element is connected to the gate electrode pad and a gate pin region of the integrated component body.

Abstract: An integrated packaging structure is provided. In the package structure, an integrated component body has a first source region, a second source region, a first setting region, and a second setting region, which are separated from each other. A first MOSFET die and a second MOSFET die are located on the first setting region and the second setting region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed from the top surface and spaced apart from each other. A first source connection element is connected to the source electrode pad of the first MOSFET die and the first source region. A second source connection element is connected to the source electrode pad of the second MOSFET die and the second source region. A gate connection element is connected to the gate electrode pad and a gate region of the integrated component body.

Abstract: A common-source type package structure is provided in the present invention. In the package structure, an integrated component body is configured a common-source pin region, a first arrangement region and a second arrangement region. The second and first arrangement regions are spaced apart from each other. A first MOSFET die and a second MOSFET are respectively located at the first and second arrangement region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed to the top surface and spaced apart from each other. A common-source connection element is connected to the source electrode pad and the common-source pin region. A gate connection element is connected to the gate electrode pad and a gate pin region of the integrated component body.

Abstract: A common-source type package structure is provided in the present invention. In the package structure, an integrated component body is configured a common-source pin region, a first arrangement region and a second arrangement region. The second and first arrangement regions are spaced apart from each other. A first MOSFET die and a second MOSFET are respectively located at the first and second arrangement region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed to the top surface and spaced apart from each other. A common-source connection element is connected to the source electrode pad and the common-source pin region. A gate connection element is connected to the gate electrode pad and a gate pin region of the integrated component body.

Abstract: A common-source type package structure is provided in the present invention. In the package structure, an integrated component body is configured a common-source pin region, a first arrangement region and a second arrangement region. The second and first arrangement regions are spaced apart from each other. A first MOSFET die and a second MOSFET are respectively located at the first and second arrangement region respectively, and have a top surface, a source electrode pad and a gate electrode pad. The source electrode pad and the gate electrode pad are exposed to the top surface and spaced apart from each other. A common-source connection element is connected to the source electrode pad and the common-source pin region. A gate connection element is connected to the gate electrode pad and a gate pin region of the integrated component body.

Abstract: A computer stick docking system and a power management method thereof are provided. The computer stick docking system includes a docking station and a computer stick device. The docking station is configured to receive a display device and a computer stick device, including a docking battery and a docking HDMI interface circuit. The computer stick device includes a computer-stick controller and a computer-stick HDMI interface circuit. The computer-stick controller is configured to load an operating system. The computer-stick HDMI interface circuit, coupled to the computer-stick controller, is configured to request battery power information of the docking battery from the docking station after it is powered on and the computer-stick HDMI interface circuit is connected to the docking station.

Abstract: A sensor system is provided. The sensor system includes a control device and a sensor device. The control device has an audio combo jack and selectively provides an audio signal to the audio combo jack. The sensor device is connected with the audio combo jack. The sensor device includes a transformer, a rectifier, a power supply circuit, and a sensor. The transformer receives the audio signal through the audio combo jack and amplifies the audio signal to generate an amplified audio signal. The rectifier, coupled to the transformer, receives the amplified audio signal and rectifies the amplified audio signal to generate a rectified voltage signal. The power supply circuit is controlled by the rectified voltage signal to provide a supply voltage. The sensor is powered by the supply voltage to perform a sensing operation. An output signal which carries information related the sensing operation is generated.

Abstract: A computer stick docking system and a power management method thereof are provided. The computer stick docking system includes a docking station and a computer stick device. The docking station is configured to receive a display device and a computer stick device, including a docking battery and a docking HDMI interface circuit. The computer stick device includes a computer-stick controller and a computer-stick HDMI interface circuit. The computer-stick controller is configured to load an operating system. The computer-stick HDMI interface circuit, coupled to the computer-stick controller, is configured to request battery power information of the docking battery from the docking station after it is powered on and the computer-stick HDMI interface circuit is connected to the docking station.

Abstract: A sensor system is provided. The sensor system includes a control device and a sensor device. The control device has an audio combo jack and selectively provides an audio signal to the audio combo jack. The sensor device is connected with the audio combo jack. The sensor device includes a transformer, a rectifier, a power supply circuit, and a sensor. The transformer receives the audio signal through the audio combo jack and amplifies the audio signal to generate an amplified audio signal. The rectifier, coupled to the transformer, receives the amplified audio signal and rectifies the amplified audio signal to generate a rectified voltage signal. The power supply circuit is controlled by the rectified voltage signal to provide a supply voltage. The sensor is powered by the supply voltage to perform a sensing operation. An output signal which carries information related the sensing operation is generated.

Abstract: A signal expansion selection device receives a plurality of selection data from users to select one of audio-video signals generated from audio-video apparatuses. Each of the audio-video signals selected by a corresponding one of the users is converted into an audio-video datum for use by the user. The signal expansion selection device includes selection ports, a processing unit, multiplexing modules, and audio-video output ports. The selection ports send the selection data to the processing unit. The processing unit processes the selection data with an algorithm to generate a control command. The multiplexing modules select one of the audio-video signals according to the control command. The processing unit decodes and converts the selected audio-video signal to audio-video data and enables the audio-video data to be sent from one of the audio-video output ports.

Abstract: A supporting structure for portable electronic products is disclosed. The supporting structure includes a main body and a first supporting unit. The first supporting unit has a first finger portion and a second finger portion. The first supporting unit is disposed on one end of the main body. The first finger portion corresponds to the second finger portion. The supporting structure allows the user to easily and stably hold a portable electronic product.

Abstract: A separate type converter is provided. The separate type converter includes a power control module having a power control circuit generating a first control signal, and a power stage module having a power stage circuit coupled to the power control circuit for receiving the first control signal and an input voltage, and generating an output voltage, in which the power control module and the power stage module are separate from each other in an assembling structure.

Abstract: The present invention provides a separate type converter. The separate type converter includes a power control module having a power control circuit generating a first control signal, and a power stage module having a power stage circuit coupled to the power control circuit for receiving the first control signal and an input voltage, and generating an output voltage, in which the power control module and the power stage module are separate from each other in an assembling structure.