Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.

Abstract: An electrical connector for an FPC includes an insulative housing (1) defining a space (11) and a pair of engage surfaces (141) at opposite sides of the space; a plurality of terminals (2, 3) side-by-side arranged in the housing and each comprising a supporting arm with a curved portion (212, 312) thereof; and an actuator (4) rotatable assembled in the space of the housing defining shafts (43) being received in the curved portions and a pair of end posts (44) respectively extending from two longitudinal ends thereof, each end post defines a project portion (441); the project portions are engage with the engage surfaces to stop the actuator from moving off while the actuator is rotated relative to the housing.

Abstract: An electrical connector for an FPC includes an insulative housing (1) defining a space (11) and a pair of engage surfaces (141) at opposite sides of the space; a plurality of terminals (2, 3) side-by-side arranged in the housing and each comprising a supporting arm with a curved portion (212, 312) thereof; and an actuator (4) rotatable assembled in the space of the housing defining shafts (43) being received in the curved portions and a pair of end posts (44) respectively extending from two longitudinal ends thereof, each end post defines a project portion (441); the project portions are engage with the engage surfaces to stop the actuator from moving off while the actuator is rotated relative to the housing.