Patents by Inventor Hsin-Lin YU

Hsin-Lin YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12262479
    Abstract: The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.
    Type: Grant
    Filed: March 16, 2023
    Date of Patent: March 25, 2025
    Assignee: UNEO INC.
    Inventors: Chih-Sheng Hou, Chia-Hung Chou, Hsin-Lin Yu, Si-Wei Chen, Chueh Chiang
  • Publication number: 20240314938
    Abstract: The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.
    Type: Application
    Filed: March 16, 2023
    Publication date: September 19, 2024
    Inventors: Chih-Sheng HOU, Chia-Hung CHOU, Hsin-Lin YU, Si-Wei CHEN, Chueh CHIANG
  • Patent number: 9762236
    Abstract: An embedded button without having gap is disclosed according to the present invention. The button area just bends to operate instead of moving back and forth to operate within a through hole so that no water, vapor, or dust shall enter into the device. One of the embodiment comprises an inner bump configured on an inner side of an outer frame; a pressure switch is configured under the inner bump and touches the bottom surface of the bump; and an activating electrical signal is triggered when the button area is pressed by user with a force exceeding a threshold force level from outside surface of the outer frame of the electronic device.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: September 12, 2017
    Assignee: UNEO INC.
    Inventors: Cheng-Tsung Chen, Hsin-Lin Yu, Chih-Sheng Hou, Chia-Hung Chou
  • Publication number: 20160225568
    Abstract: An embedded button without having gap is disclosed according to the present invention. The button area just bends to operate instead of moving back and forth to operate within a through hole so that no water, vapor, or dust shall enter into the device. One of the embodiment comprises an inner bump configured on an inner side of an outer frame; a pressure switch is configured under the inner bump and touches the bottom surface of the bump; and an activating electrical signal is triggered when the button area is pressed by user with a force exceeding a threshold force level from outside surface of the outer frame of the electronic device.
    Type: Application
    Filed: February 2, 2015
    Publication date: August 4, 2016
    Inventors: Cheng-Tsung CHEN, Hsin-Lin YU, Chih-Sheng HOU, Chia-Hung CHOU