Abstract: A charging gun holster for mounting a first charging gun or a second charging gun, includes a housing. The housing includes a socket inside, and the socket is formed by a circular groove connected to a cave, which the circular groove is formed by a first inner wall and the cave is formed by a second inner wall. The cave is configured to engage a head of the second charging gun. The circular groove is configured to engage a head of the first charging gun, and a first side of the housing is against a body of the first charging gun to limit the depth of the first charging gun inserting into the annular groove.

Abstract: A lithography system includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket, a rail guide, and a first protective film. The first sliding member is coupled to the wafer stage. The second sliding member is coupled to an edge of the table body, in which the first sliding member is coupled to a track of the second sliding member. The first bracket fixes the first cable, the first bracket being coupled to a roller structure, in which the roller structure includes a body and a wheel coupled to the body. The rail guide confines a movement of the wheel of the roller structure. The first protective film is adhered to a surface of the rail guide, in which the roller structure is moveable along the first protective film on the surface of the rail guide.

Abstract: Methods and apparatuses for a lithography exposure process are described. The method includes irradiating a target droplet with a laser beam to create an extreme ultraviolet (EUV) light. The methods utilized and the apparatuses include two or more collectors for collecting the generated EUV light and reflecting the collected EUV light to a focal point of one of the collectors. In some embodiments, one of the two collectors includes a ring-shaped collector.

Abstract: An extreme ultraviolet (EUV) source includes a collector associated with the vessel. The extreme ultraviolet (EUV) source includes a plurality of vanes along walls of the vessel. Each vane includes a stacked vane segment, and the stacked vane segments for each vane are stacked in a direction of drainage of tin (Sn) in the vessel. The EUV source includes a thermal control system comprising a plurality of independently controllable heating elements, where a heating element is configured to provide localized control for heating of a vane segment of the stacked vane segments.

Abstract: In examples, an isolation device comprises a multi-level substrate having opposing first and second surfaces. The multi-level substrate includes a first coil in a first layer of the substrate, the first coil having first and second terminals, a second coil in a second layer of the substrate that is vertically distanced from the first layer, the second coil having third and fourth terminals, and a dielectric material covering the first and second coils. The device comprises a first semiconductor die coupled to the first surface and to the first and second terminals, a second semiconductor die coupled to the second surface and to the third and fourth terminals, the second semiconductor die galvanically isolated from the first semiconductor die, conductive terminals coupled to the multi-level substrate, and a mold compound covering the multi-level substrate, the first and second semiconductor dies, and the conductive terminals.

Abstract: A memory system that is based on 3D NAND flash memory of a high capacity and/or capable of high performance is provided, which includes memory planes, each including a plane core and a specific set of resources. For each memory plane of the plurality of memory planes, the technology provides (i) a corresponding plane busy (PRDY) signal indicating a busy or a ready state of the specific set of recourses of the corresponding memory plane, and (ii) a corresponding plane in operation (PIO#) signal indicating an in operation or idle state of resources used by the plane core of the corresponding memory plane. Issuance of memory commands by a controller and execution of memory commands for a memory plane of the plurality of memory planes is selectively allowed or denied, based on status of one or more of the plurality of PRDY signals and the plurality of PIO# signals.

Abstract: An electronic device includes a chassis casing, a device casing, a latch assembly, a bracket, and a rotating shaft assembly. The chassis casing includes a bottom plate. The device casing is detachably disposed in the chassis casing, and the device casing is provided with a stopper. The latch assembly is disposed at the chassis casing, and the latch assembly includes a sliding member. The bracket is disposed in the chassis casing and at an end of the device casing opposite to the latch assembly. The rotating shaft assembly is respectively connected to the device casing and the bracket. The device casing is adjustable between an installation position and an lifting position via the rotating shaft assembly. The sliding member of the latch assembly is used to fix the stopper, so that the device casing is located at the installation position.

Abstract: A semiconductor device includes an emitter, a first base encircling the emitter, a first collector encircling the emitter and the first base, a second base encircling the emitter, the first base and the first collector, and a second collector encircling the second base. The first collector is separated from the emitter by the first base, and the second collector is separated from the emitter, the first base and the first collector by the second base. The emitter, the first base, the first collector, the second base and the second collector form a concentric pattern.

Abstract: A portable coating device for applying a coating solution onto a solar panel includes a supply module for supplying the coating solution, a base, a spraying module disposed on the base, a transmission module disposed at two opposite ends of the base, an arc bracket, and an applicator. The base spans the solar panel and moves thereon through the support of the transmission module. The arc bracket is disposed at the bottom of the base and has a plurality of seepage openings, and an inner surface of the arc bracket faces the spraying module. The applicator includes a porous material that deforms under pressure. The applicator is assembled to the base and supported by the arc bracket.

Abstract: A calibration method of the magnetic field model and a controller for electromagnetic positioning are provided. In the method, a magnetic field is established through a magnetic field transmitter; measurement data is obtained through a magnetic field sensor, where the measurement data includes the amplitude of induced voltage at multiple measurement positions in the magnetic field; and the magnetic field model is corrected according to the error between the measurement data and simulated data correction, where the magnetic field model is used to generate simulation data corresponding to multiple measurement locations. The steps of modifying the magnetic field model include: establishing one or more objective functions through the nonlinear least squares method based on the error between the measured data and the simulated data; and determining the modified magnetic field model based on one or more solutions of the objective function. Therefore, positioning accuracy can be improved.

Abstract: A system and method for dynamically controlling a temperature of a thermostatic reticle. A thermostatic reticle assembly that includes a reticle, temperature sensors located in proximity to the reticle, and one or more heating elements. A thermostat component that is in communication with the temperature sensors and the heating element monitors the current temperature of the reticle relative to a steady-state temperature. In response to the current temperature of the reticle being lower than the steady-state temperature, the heating elements are activated to preheat the reticle to the steady-state temperature.

Abstract: A load-lock chamber with reduced particle contamination is disclosed. At least one movable particle shield is placed between the gate valve and a wafer location. Particles which can be generated due to contact between the gate valve door and its seat are blocked or inhibited by the particle shield from landing in the wafer location, reducing particle contamination. Methods for operating the load-lock chamber are also disclosed.

Abstract: A system for monitoring and controlling an EUV light source includes a first temperature sensor, a signal processor, and a process controller. The first temperature sensor includes a portion inserted into a space surrounded by a plurality of vanes through a vane of the plurality of vanes, and obtains an ambient temperature that decreases with time as a function of tin contamination coating on the inserted portion. The signal processor determines an excess tin debris deposition on the vane based on the obtained chamber ambient temperature. The process controller activates a vane cleaning action upon being informed of the excess tin debris deposition by the signal processor, thereby improving availability of the EUV light source tool and reducing risks of tin pollution on other tools such as a reticle.

Abstract: A driving method of a transcranial magnetic stimulation 3D coil device is disclosed, which includes: determining first and second signal peaks corresponding to a specified rotating magnetic field direction, in which the first and second signal peaks respectively correspond to first and second coils in multiple coils; providing a first pulse current having the first signal peak to the first coil, in which the first pulse current signal stimulates the first coil to provide a first magnetic field; providing a second pulse current signal having a second signal peak to the second coil, in which the second pulse current signal stimulates the second coil to provide a second magnetic field, in which the first magnetic field and the second magnetic field form a rotating magnetic field having the specified rotating magnetic field direction.

Abstract: Some implementations described herein provide an exposure tool and associated methods of operation in which a scanner control system generates a scanner route for an exposure recipe such that the distance traveled by a substrate stage of the exposure tool along the scanner route is reduced and/or optimized for non-exposure fields on a semiconductor substrate. In this way, the scanner control system increases the productivity of the exposure tool, reduces processing times of the exposure tool, and increases yield in a semiconductor fabrication facility in which the exposure tool is included.

Abstract: A method includes irradiating debris deposited in an extreme ultraviolet (EUV) lithography system with laser, controlling one or more of a wavelength of the laser or power of the laser to selectively vaporize the debris and limit damage to the EUV) lithography system, and removing the vaporized debris.

Abstract: A method includes: depositing a mask layer over a substrate; directing first radiation reflected from a central collector section of a sectional collector of a lithography system toward the mask layer according to a pattern; directing second radiation reflected from a peripheral collector section of the sectional collector toward the mask layer according to the pattern, wherein the peripheral collector section is vertically separated from the central collector section by a gap; forming openings in the mask layer by removing first regions of the mask layer exposed to the first radiation and second regions of the mask layer exposed to the second radiation; and removing material of a layer underlying the mask layer exposed by the openings.

Abstract: An optical sensing device and a method for manufacturing the same are provided. The optical sensing device comprises a substrate, an optical acting area, a filter layer and a carbonized sidewall. The optical acting area is disposed on the substrate. The filter layer covers the optical acting area and selectively allows only a light beam with a specific wavelength to pass therethrough and be received by the optical acting area while blocking the light beams with other wavelengths. The carbonized sidewall covers the sidewall of the filter layer and a portion of the sidewall of the substrate to prevent the light beams with the other wavelengths from being received by the optical acting area through the sidewall of the substrate.

Abstract: An integrated circuit structure includes an aluminum pad layer on a dielectric stack, a passivation layer covering the aluminum pad layer, and an aluminum shield layer including aluminum routing patterns disposed directly above an embedded memory area and embedded in the dielectric stack. The aluminum shield layer is electrically connected to the uppermost copper layer through a plurality of tungsten vias. The plurality of tungsten vias is embedded in the dielectric stack.

Abstract: A method includes: positioning a wafer on an electrostatic chuck of an apparatus; and securing the wafer to the electrostatic chuck by: securing a first wafer region of the wafer to a first chuck region of the electrostatic chuck by applying a first voltage at a first time. The method further includes securing a second wafer region of the wafer to a second chuck region of the electrostatic chuck by applying a second voltage at a second time different from the first time; and processing the wafer by the apparatus while the wafer is secured to the electrostatic chuck.