Abstract: A multi-die QFN hybrid package includes a carrier having flip-chip leads and wire-bonding leads. A first die and a second die are mounted on the flip-chip leads, respectively, in a flip-chip manner. The first die is spaced apart from the second die. A third die is stacked over the first die and the second die. The third die is electrically connected to the wire-bonding leads around the first die and the second die through bond wires. A mold cap encapsulates the first die, the second die, the third die, the bond wires, and partially encapsulates the carrier. The flip-chip leads and the wire-bonding leads are exposed from a bottom mold cap surface.

Abstract: The present disclosure provides an electronic package and a method for fabricating the same. The method including: connecting a first carrier structure with an electronic component via a bonding layer formed thereon; stacking the first carrier structure on a second carrier structure via a plurality of conductive elements; and electrically connecting the electronic component to the second carrier structure to thereby maintain and secure the distance between the first and second carrier structures.

Abstract: A composite lamp includes a base, a light-transmittable cover, a light-emitting device, a reflection seat, and a light-guiding rod. The light-emitting device includes multiple pieces of first light-emitting element and at least one piece of second light-emitting element. The reflection seat defines a reflective surface facing towards the cover and defines a rear slot and a front slot respectively facing the base and the cover. The first light-emitting elements are installed in the rear slot to face the reflective surface, so that the light emitting from the first light-emitting elements can be reflected by the reflective surface to pass through the cover. The light-guiding rod is disposed in the front slot. The second light-emitting element is adjacent to one end surface of the light-guiding rod, so that the light emitting from the second light-emitting element can enter the light-guiding rod and then pass through the cover.