Patents by Inventor Hsin-Lun Su
Hsin-Lun Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230413594Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: ApplicationFiled: September 4, 2023Publication date: December 21, 2023Inventors: Hui-Ru WU, Jian-Chin LIANG, Jo-Hsiang CHEN, Lung-Kuan LAI, Cheng-Yu TSAI, Hsin-Lun SU, Ting-Kai CHEN
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Patent number: 11778845Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: GrantFiled: May 15, 2022Date of Patent: October 3, 2023Assignee: Lextar Electronics CorporationInventors: Hui-Ru Wu, Jian-Chin Liang, Jo-Hsiang Chen, Lung-Kuan Lai, Cheng-Yu Tsai, Hsin-Lun Su, Ting-Kai Chen
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Publication number: 20230074731Abstract: A pixel unit includes a substrate, a wiring layer and three light-emitting elements. The wiring layer includes first electrode wires and second electrode wires. The first electrode wires and the second electrode wires are arranged side by side and separated from each other by a spacing. A first blocking wall structure is at a first end portion of each of the first electrode wires, the first end portion is near the corresponding second electrode wires, and a second blocking wall structure is at a second end portion of each of the second electrode wires, the second end portion is near the corresponding first electrode wires. Three light-emitting elements emit red light, green light and blue light respectively. The light-emitting elements are in a flip chip configuration and are connected to one of the first electrode wires and one of the second electrode wires adjacent to each other respectively.Type: ApplicationFiled: September 5, 2022Publication date: March 9, 2023Inventors: Chih-Hao LIN, Hsin-Lun SU, Min-Che TSAI, Jo-Hsiang CHEN
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Publication number: 20220271251Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: ApplicationFiled: May 15, 2022Publication date: August 25, 2022Inventors: Hui-Ru WU, Jian-Chin LIANG, Jo-Hsiang CHEN, Lung-Kuan LAI, Cheng-Yu TSAI, Hsin-Lun SU, Ting-Kai CHEN
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Patent number: 11367849Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: GrantFiled: December 25, 2018Date of Patent: June 21, 2022Assignee: Lextar Electronics CorporationInventors: Hui-Ru Wu, Jian-Chin Liang, Jo-Hsiang Chen, Lung-Kuan Lai, Cheng-Yu Tsai, Hsin-Lun Su, Ting-Kai Chen
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Publication number: 20200067009Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.Type: ApplicationFiled: December 25, 2018Publication date: February 27, 2020Inventors: Hui-Ru WU, Jian-Chin LIANG, Jo-Hsiang CHEN, Lung-Kuan LAI, Cheng-Yu TSAI, Hsin-Lun SU, Ting-Kai CHEN
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Patent number: 10312408Abstract: A light emitting diode chip scale packaging structure and a direct type backlight module are disclosed. The light emitting diode chip scale packaging structure includes a light emitting diode chip, a wavelength converting layer, a diffusion structure and a lens. The wavelength converting layer is disposed on the light emitting diode chip and directly contacting the light emitting diode chip, and the wavelength converting layer includes phosphor powders. The diffusion structure covers the light emitting diode chip and the wavelength converting layer, a ratio of a height of the diffusion structure to a width of the diffusion structure is 1:2 to 5:4, and the lens covers the diffusion structure. An outer surface of the lens is a free-form surface, and a material of the lens is different from a material of the diffusion structure.Type: GrantFiled: October 2, 2017Date of Patent: June 4, 2019Assignee: LEXTAR ELECTRONICS CORPORATIONInventors: Che-Hsuan Huang, Hsin-Lun Su, Shu-Hsiu Chang, Chih-Hao Lin, Tzong-Liang Tsai
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Patent number: 10141476Abstract: A light emitting diode chip scale packaging structure is disclosed. The light emitting diode chip scale packaging structure comprises a light emitting diode chip and a lens. The lens covers the light emitting diode chip. A curve of an outer surface of the lens in a cross-section view substantially complies with a polynomial of: z=?i=0nai*yi, A center point of the curve corresponding to the light emitting diode chip is a zero point of y-z coordinate axes. z is a variable of vertical axis of the curve. y is a variable of horizontal axis of the curve. ai is a constant coefficient in a term of ith degree. 3<n?6.Type: GrantFiled: June 9, 2017Date of Patent: November 27, 2018Assignee: LEXTAR ELECTRONICS CORPORATIONInventors: Che-Hsuan Huang, Shu-Hsiu Chang, Hsin-Lun Su, Chih-Hao Lin, Tzong-Liang Tsai
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Publication number: 20180102459Abstract: A light emitting diode chip scale packaging structure and a direct type backlight module are disclosed. The light emitting diode chip scale packaging structure includes a light emitting diode chip, a wavelength converting layer, a diffusion structure and a lens. The wavelength converting layer is disposed on the light emitting diode chip and directly contacting the light emitting diode chip, and the wavelength converting layer includes phosphor powders. The diffusion structure covers the light emitting diode chip and the wavelength converting layer, a ratio of a height of the diffusion structure to a width of the diffusion structure is 1:2 to 5:4, and the lens covers the diffusion structure. An outer surface of the lens is a free-form surface, and a material of the lens is different from a material of the diffusion structure.Type: ApplicationFiled: October 2, 2017Publication date: April 12, 2018Inventors: Che-Hsuan Huang, Hsin-Lun Su, Shu-Hsiu Chang, Chih-Hao Lin, Tzong-Liang Tsai
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Publication number: 20170358709Abstract: A light emitting diode chip scale packaging structure is disclosed. The light emitting diode chip scale packaging structure comprises a light emitting diode chip and a lens. The lens covers the light emitting diode chip. A curve of an outer surface of the lens in a cross-section view substantially complies with a polynomial of: z=?i=0nai*yi, A center point of the curve corresponding to the light emitting diode chip is a zero point of y-z coordinate axes. z is a variable of vertical axis of the curve. y is a variable of horizontal axis of the curve. ai is a constant coefficient in a term of ith degree. 3<n?6.Type: ApplicationFiled: June 9, 2017Publication date: December 14, 2017Inventors: Che-Hsuan Huang, Shu-Hsiu Chang, Hsin-Lun Su, Chih-Hao Lin, Tzong-Liang Tsai
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Patent number: 9659914Abstract: A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.Type: GrantFiled: August 5, 2015Date of Patent: May 23, 2017Assignee: Lextar Electronics CorporationInventors: Yi-Jyun Chen, Chih-Hao Lin, Hsin-Lun Su, Fang-Chang Hsueh
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Publication number: 20160365493Abstract: A light-emitting diode device includes a shell with a recess, wherein the shell does not contain metal oxide. A plurality of lead frames extends from the bottom of the recess to the outside of the shell. At least an UV light-emitting diode (LED) chip is disposed on the bottom of the recess and is electrically connected to the lead frames, wherein the UV LED chip has a wavelength range of 200 nm-400 nm. In addition, an encapsulation adhesive fills the recess to cover the UV LED chip.Type: ApplicationFiled: February 25, 2016Publication date: December 15, 2016Inventors: Hsin-Lun SU, Chih-Hao LIN, Fang-Chang HSUEH, Tzong-Liang TSAI, Yi-Jyun CHEN
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Publication number: 20160300821Abstract: A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.Type: ApplicationFiled: June 17, 2016Publication date: October 13, 2016Inventors: Yi-Jyun Chen, Chih-Hao Lin, Hsin-Lun Su, Fang-Chang Hsueh
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Publication number: 20160247787Abstract: A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.Type: ApplicationFiled: August 5, 2015Publication date: August 25, 2016Inventors: Yi-Jyun Chen, Chih-Hao Lin, Hsin-Lun Su, Fang-Chang Hsueh