Abstract: The cleaning apparatus for solder paste in apertures according to the present invention comprises a stencil, a guiding plate, and a blower. The stencil has a plurality of apertures with residual solder paste on the sidewalls thereof. The guiding plate is disposed above the stencil and has a plurality of wind-guiding pillars and a plurality of wind-guiding holes. The locations of the wind-guiding pillars are opposite to the locations of the apertures; the wind-guiding holes are located around the wind-guiding pillars. The blower is disposed above the guiding plate and provides a gas to the guiding plate. The gas is guided into the apertures by means of the wind-guiding pillars and the wind-guiding holes and pushes completely the solder paste therein out. Thereby, accumulation of solder paste in the sidewalls of the apertures can be avoided. Consequently, deterioration of adhesion of electronic components caused by fewer amount of solder paste printed on the carrier can be prevented.