Abstract: A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.

Abstract: The present invention provides a method for manufacturing a touch electrode substrate, including the steps of (A) selecting a preset substrate for forming a substrate layer; (B) forming a conductive layer on at least one surface of the substrate layer; (C) depositing a photoresist on the conductive layer, performing a first exposure, and forming a first exposure pattern on the conductive layer; (D) performing a second exposure on the conductive layer, and forming a second exposure pattern on the conductive layer; (E) forming a shielding layer that has a circuit pattern, by means of developing the first exposure pattern and the second exposure pattern; and (F) processing the conductive layer and the shielding layer, to enable the conductive layer to form a plurality of metal circuits on at least one surface of the substrate layer.

Abstract: A circuit board manufacturing method includes the steps of providing a conductive motherboard; forming a masking layer on the conductive motherboard, and the masking layer having a plurality of recessed portions that form a predetermined circuit pattern; forming a conductive electrode in each recessed portion, and the conductive electrodes together forming a conductive layer; providing a substrate having an adhesive layer provided thereon for sticking to a top of the masking layer and the conductive layer; and separating the substrate, the adhesive layer and the conductive layer from the conductive motherboard and the masking layer to provide a circuit board. The conductive motherboard is repeatedly usable and presents the predetermined circuit pattern through electroforming process, and the circuit pattern can be transferred to the substrate. The whole circuit board manufacturing process is simplified while ensures largely upgraded yield rate of very fine conductive circuit lines on the circuit board.

Abstract: A temperature measuring board for use in measuring an oven temperature of a reflow oven includes a modular substrate and a thermal compensation unit. The modular substrate includes a plurality of substrates assembled to each other. Each substrate has at least one first fixing portion, and at least one second fixing portion removably fixed to the first fixing portion of another substrate. A selected number of the substrates can be assembled to each other to form a desired shape of the modular substrate through engagement of the first and second fixing portions. The thermal compensation unit includes at least one surface-measured compensation member fixed to the modular substrate at a selected location.

Abstract: A testing apparatus and a testing method are disclosed. The testing apparatus has a testing assembly. The testing assembly includes a first plate body, a testing paper, and a second plate body. The first plate body has a plurality of pins; the testing paper includes a plurality of first through holes whose locations correspond to the plurality of pins. The second plate body connects with the testing paper and has a plurality of second through holes whose locations correspond to the first through holes for allowing the plurality of pins to pass through the corresponding through holes. A sprayer is located, beneath the second plate body and sprays flux onto the inner wall of each second through hole, and a plurality of wet marks are left on the testing paper for interpretation of the coating quality.

Abstract: A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position.

Abstract: A circuit board assembling system includes a circuit board whereon a slot is formed. The circuit board includes a first region and a second region. The circuit board assembling system further includes a component placement machine, a positioning rod, wherein a first width of the unadjusted positioning rod is larger than a width of the slot so that the unadjusted positioning rod can not pass through the slot, a conveying device for driving the circuit board to a positioning point in a first direction and driving the circuit board to an assembling position in a second direction, and a control unit for controlling the conveying device to drive the circuit board to the assembling position in the second direction and controlling the component placement machine to assemble a first component set and a second component set on the first region and the second region respectively.

Abstract: A printed circuit board, a supporting jig, and a positioning method are disclosed, wherein the supporting jig is used for positioning a printed circuit board to facilitate surface mount technology (SMT) procedures. The printed circuit board includes a circuit board locating hole, and a first magnet, wherein the first magnet is accommodated in the circuit board locating hole. The supporting jig has a jig locating hole and a second magnet. The jig locating hole is beneath the circuit board locating hole. The second magnet is accommodated in the jig locating hole so that the printed circuit board can be fixed on the supporting jig by the magnetic attraction between the first magnet and the second magnet.

Abstract: A heat dissipation module for lowering the temperature of a heating element is disclosed. The heat dissipation module comprises a heat dissipation module body, a container, and a liquid element. The heat dissipation module body is made of a heat conductive material; the container is installed in the heat dissipation module body; and the liquid element is disposed in the container. Therefore, when the heat dissipation module is in contact with the heating element, heat generated by the heating element is absorbed by the heat dissipation module body and the liquid element.

Abstract: A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position.