Patents by Inventor HSIN-MIN HSIAO

HSIN-MIN HSIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION, METHOD FOR MAKING RESIN COMPOSITION AND FILM FOR CIRCUIT BOARD, AND CIRCUIT BOARD
    Publication number: 20180223048
    Abstract: A resin composition having lower dielectric constant Dk, lower dielectric loss Df, lower water absorption, higher surface impedance, and higher glass transition temperature includes resins. The resins have a chemical structure selected from a group consisting of or any combination thereof.
    Type: Application
    Filed: August 25, 2017
    Publication date: August 9, 2018
    Inventors: MAO-FENG HSU, SHOU-JUI HSIANG, SZU-HSIANG SU, YU-WEN KAO, CHIA-YIN TENG, MING-JAAN HO, YAO-YI CHENG, HSIN-MIN HSIAO