Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A transistor includes a first semiconductor layer, a second semiconductor layer, a semiconductor nanosheet, a gate electrode and source and drain electrodes. The semiconductor nanosheet is physically connected to the first semiconductor layer and the second semiconductor layer. The gate electrode wraps around the semiconductor nanosheet. The source and drain electrodes are disposed at opposite sides of the gate electrode. The first semiconductor layer surrounds the source electrode, the second semiconductor layer surrounds the drain electrode, and the semiconductor nanosheet is disposed between the source and drain electrodes.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A LED lamp having a locking device includes a lamp housing, a heat-sink, a locking device and a LED light-emitting module. The lamp housing has a cylinder. The heat-sink is formed with an annular wall. The locking device comprises a first thread formed at an outer periphery of the cylinder, a hook extending from one end of the cylinder, a second thread formed in the inner wall of the annular wall and threadedly connected with the first thread, and a groove defined on the annular wall and locked with the hook. The LED light-emitting module is placed in the heat-sink and connected to an end of the heat-sink away from the lamp housing. By the above arrangement, a secure and firm connection between the lamp housing and the heat-sink can be achieved.