Patents by Inventor Hsin-Sheng Hsia

Hsin-Sheng Hsia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7516539
    Abstract: An apparatus for transplanting a multi-board is provided. This apparatus includes an orientation device, a calibration device, and an image-adjusting device. The orientation device has a first movable platform, and the multi-board is fixed on the first movable platform. The calibration device has a second movable platform and is used for moving a substitution circuit board to a recombination position of the multi-board. The image-adjusting device captures image data of the multi-board and the substitution circuit board and compares the image data to obtain an error signal. The calibration device receives the error signal and moves the second movable platform according to the error signal in order to calibrate the relative position between the substitution circuit board and the multi-board.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: April 14, 2009
    Assignee: Unimicron Technology Corp.
    Inventor: Hsin-Sheng Hsia
  • Publication number: 20080244897
    Abstract: An apparatus for transplanting a multi-board is provided. This apparatus includes an orientation device, a calibration device, and an image-adjusting device. The orientation device has a first movable platform, and the multi-board is fixed on the first movable platform. The calibration device has a second movable platform and is used for moving a substitution circuit board to a recombination position of the multi-board. The image-adjusting device captures image data of the multi-board and the substitution circuit board and compares the image data to obtain an error signal. The calibration device receives the error signal and moves the second movable platform according to the error signal in order to calibrate the relative position between the substitution circuit board and the multi-board.
    Type: Application
    Filed: July 20, 2007
    Publication date: October 9, 2008
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventor: Hsin Sheng Hsia