Patents by Inventor Hsin-Sheng Liu

Hsin-Sheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240282687
    Abstract: A manufacturing method of the circuit board includes the following steps. A metal layer, a first substrate, a second substrate, and a third substrate are laminated. Multiple blind holes and a through hole are formed. A conductive material layer is formed, which covers the metal layer, the conductive layer of the third substrate, and an inner wall of the through hole, and fills the blind holes to define multiple conductive holes. The conductive material layer, the metal layer, and the conductive layer are patterned to form a first external circuit layer located on the first substrate and electrically connected to the conductive pillars, and a second external circuit layer located on the insulating layer and electrically connected to the conductive holes, and define a conductive through hole structure connecting the first external circuit layer and the second external circuit layer and located in the through hole.
    Type: Application
    Filed: April 29, 2024
    Publication date: August 22, 2024
    Applicant: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Hsin-Ning Liu, Jun-Rui Huang, Pei-Wei Wang, Ching Sheng Chen, Shih-Lian Cheng
  • Patent number: 12057381
    Abstract: A circuit board includes a first external circuit layer, a first substrate, a second substrate, a third substrate, and a conductive through hole structure. The first substrate includes conductive pillars electrically connecting the first external circuit layer and the second substrate. The second substrate has an opening and includes a first dielectric layer. The opening penetrates the second substrate, and the first dielectric layer fills the opening. The third substrate includes an insulating layer, a second external circuit layer, and conductive holes. A conductive material layer of the conductive through hole structure covers an inner wall of a through hole and electrically connects the first and the second external circuit layers to define a signal path. The first external circuit layer, the conductive pillars, the second substrate, the conductive holes and the second external circuit layer are electrically connected to define a ground path surrounding the signal path.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: August 6, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Hsin-Ning Liu, Jun-Rui Huang, Pei-Wei Wang, Ching Sheng Chen, Shih-Lian Cheng
  • Patent number: 8688829
    Abstract: The method for binding a sensor and an actuator can be categorized into three types: manual binding, automatic binding and semi-automatic binding. Manual binding methods increase users' operational burden when a great number of sensors and actuators are to be bound. The current hard-coded automatic binding method suffers from lack of versatility. The template-based semi-automatic binding method still requires users to input some information manually. The disclosure provides an automatic binding method, which can automatically and reasonably bind the functions of a sensor and an actuator without user input, in a sensor network comprising a plurality of sensors and actuators.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: April 1, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yueh Feng Lee, Hsin Sheng Liu, Ming Shyan Wei, Yang Jung Li
  • Publication number: 20120226366
    Abstract: The method for binding a sensor and an actuator can be categorized into three types: manual binding, automatic binding and semi-automatic binding. Manual binding methods increase users' operational burden when a great number of sensors and actuators are to be bound. The current hard-coded automatic binding method suffers from lack of versatility. The template-based semi-automatic binding method still requires users to input some information manually. The disclosure provides an automatic binding method, which can automatically and reasonably bind the functions of a sensor and an actuator without user input, in a sensor network comprising a plurality of sensors and actuators.
    Type: Application
    Filed: September 19, 2011
    Publication date: September 6, 2012
    Applicant: Industrial Technology Research Institute
    Inventors: Yueh Feng LEE, Hsin Sheng Liu, Ming Shyan Wei, Yang Jung Li
  • Patent number: 8213362
    Abstract: A method for a new node to join an ad-hoc network is provided. The method includes two basic functions. When the new node is allowed to join the network, the indicating device of the node being joined generates an indication. When the new node joins the network, the indicating device of the new node also generates an indication. The method further includes two commands, the join-rejection command and the joined-rejection command, to cancel the join procedure when the indicating device of the new node and the node being joined do not indicate correspondingly. Accordingly, the method efficiently reduces the possibility of joining an unanticipated node.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: July 3, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Yueh-Feng Lee, Chun-Hao Peng, Yu-Wei Su, Hsin-Sheng Liu
  • Publication number: 20100150063
    Abstract: A method for a new node to join an ad-hoc network is provided. The method includes two basic functions. When the new node is allowed to join the network, the indicating device of the node being joined generates an indication. When the new node joins the network, the indicating device of the new node also generates an indication. The method further includes two commands, the join-rejection command and the joined-rejection command, to cancel the join procedure when the indicating device of the new node and the node being joined do not indicate correspondingly. Accordingly, the method efficiently reduces the possibility of joining an unanticipated node.
    Type: Application
    Filed: June 24, 2009
    Publication date: June 17, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yueh-Feng Lee, Chun-Hao Peng, Yu-Wei Su, Hsin-Sheng Liu