Abstract: The present invention, a method for decreasing wafer scrap rate in the chemical treatment apparatus, performs the controls of the robots, the drain valve of the chemical treatment bath and the supply valve of ultra-pure water to decrease the reaction rate between a wafer and the chemical treatment liquid, wherein the controls are performed in accordance with different abnormal factors, such as the abnormal conditions of power supply and the robots. The present invention can be used in the control system, such as by writing a recipe added to the control system. When an alarm occurs, the control system can execute the recipe to decrease the wafer damage. According to the present invention, the method for decreasing wafer scrap rate in the chemical treatment apparatus has the advantages of saving the wafer-manufacturing cost and increasing the wafer-manufacturing yield.

Abstract: A chemical bath having liquid level indications in an outer trough is disclosed. The present invention adds an aqueduct in the outer bath of the chemical bath, and the chemical treatment liquid could flow into the aqueduct. According to the Pascal's law, the liquid level of the chemical treatment liquid in the aqueduct is the same with the liquid level of the chemical treatment liquid in the outer bath. Therefore, the level height of the chemical treatment liquid in the outer bath is observed from the transparent aqueduct by the naked eyes. The present invention abridges the complicated checkup steps, so that the producing time of apparatuses is increased and the amount of the wastes chemicals is decreased.

Abstract: A wet cleaning device for chemically cleaning a plurality of wafers. The wet cleaning device includes a plurality of first chemical cleaning tanks for conducting a first cleaning procedure, a plurality of second chemical cleaning tanks for conducting a second cleaning procedure, a transferring tank including a first measuring device for measuring the wafers after the first cleaning procedure, a measuring tank including a second measuring device for measuring the wafers after the second cleaning procedure, a first transporting device, and a second transporting device.