Patents by Inventor Hsin Tai

Hsin Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250066657
    Abstract: A mineral oil based coolant for immersion cooling systems, which contains polyalphaolefins and a modifier that lower the viscosity of the polyalphaolefins when mixed with the polyalphaolefins. The polyalphaolefins comprises poly(1-decene). The modifier comprises one or more fatty alcohols. The one or more fatty alcohols comprises four-seven carbon fatty alcohols. The four-seven carbon fatty alcohols comprise butanol or heptanol. The modifier comprises one or more fatty acids.
    Type: Application
    Filed: January 6, 2023
    Publication date: February 27, 2025
    Inventors: Chih-Hsin Chen, Chin-Te Chen, Chih-Cheng Tai
  • Patent number: 12218239
    Abstract: A semiconductor structure includes an isolation feature formed in the semiconductor substrate and a first fin-type active region. The first fin-type active region extends in a first direction. A dummy gate stack is disposed on an end region of the first fin-type active region. The dummy, gate stack may overlie an isolation structure. In an embodiment, any recess such as formed for a source/drain region in the first fin-type active region will be displaced from the isolation region by the distance the dummy gate stack overlaps the first fin-type active region.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: February 4, 2025
    Assignee: Mosaid Technologies Incorporated
    Inventors: Shao-Ming Yu, Chang-Yun Chang, Chih-Hao Chang, Hsin-Chih Chen, Kai-Tai Chang, Ming-Feng Shieh, Kuei-Liang Lu, Yi-Tang Lin
  • Publication number: 20250038002
    Abstract: An exemplary method for forming a gate stack of a multigate device includes forming a gate dielectric over a channel layer and forming a gate electrode over the gate dielectric. Forming the gate electrode includes forming a work function layer over the gate dielectric and forming a cap over the work function layer. Forming the cap includes forming a metal nitride layer over the work function layer and forming a silicon-comprising layer over the metal nitride layer. Forming the gate electrode includes forming a fluorine-free tungsten layer over the silicon-comprising layer of the cap without breaking vacuum. Forming the fluorine-free tungsten layer over the silicon-comprising layer includes co-flowing a tungsten-comprising precursor (e.g., WCl5) and a hydrogen-comprising precursor (e.g., H2).
    Type: Application
    Filed: November 30, 2023
    Publication date: January 30, 2025
    Inventors: Chih-Wei Lee, Hsin-Han Tsai, You Tai Tsai
  • Publication number: 20240328078
    Abstract: An artificial leather and a method for manufacturing the artificial leather are provided. The artificial leather includes a fabric layer, a thermoplastic polyolefin layer, a modified thermoplastic polyolefin layer, and a polyurethane surface layer. The thermoplastic polyolefin layer is disposed on the fabric layer. The modified thermoplastic polyolefin layer is disposed on the thermoplastic polyolefin layer. The polyurethane surface layer is attached to the modified thermoplastic polyolefin layer through an adhesive.
    Type: Application
    Filed: March 20, 2024
    Publication date: October 3, 2024
    Inventors: CHIH-YI LIN, Kuo-Kuang Cheng, Chien-Chia Huang, Chi-Chin Chiang, Wen-Hsin Tai, Chieh Lee, Yu-Lun Chen, Yu Hung Liu
  • Publication number: 20240260183
    Abstract: The present disclosure is relates to a conductive film and a manufacturing method thereof. The conductive film includes a base layer, a TPU complex layer, a conductive layer and a TPU surface layer. The TPU complex layer includes a TPU heat-resistant layer and a TPU melting layer. The TPU heat-resistant layer is disposed on the TPU melting layer, and the TPU melting layer is disposed on the base layer. The conductive layer includes a conductive circuit disposed on the TPU heat-resistant layer. The TPU surface layer is disposed on the conductive layer. Utilizing the TPU complex layer, the conductive layer does not contact directly with the base layer to avoid breaking the conductive line of the conductive layer when the base layer is pulled. Therefore, the lifetime of the conductive film can be increased.
    Type: Application
    Filed: April 11, 2024
    Publication date: August 1, 2024
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, I-Ju Wu, Chi-Ho Tien
  • Publication number: 20240226667
    Abstract: The present disclosure is relates to a TPU ball structure and a manufacturing method thereof. The TPU ball structure includes a ball bladder layer, a yarn layer and a surface layer. The ball bladder layer is made of TPU material. The yarn layer is made of TPU material, and the yarn layer is disposed to cover the ball bladder layer. The surface layer is made of TPU material, and the surface layer is disposed to cover the yarn layer. The above layers of the TPU ball structure are made of TPU material to satisfy a requirement for environmental protection, and are recyclable. There is no need to use adhesive to adhere the above layers of the TPU ball structure. Therefore, the peeling strength between the layers of the TPU ball structure can be increased so that the whole peeling strength of the TPU ball structure can be increased.
    Type: Application
    Filed: March 21, 2024
    Publication date: July 11, 2024
    Inventors: Chih-Yi LIN, Kuo-Kuang CHENG, Chi-Chin CHIANG, Wen-Hsin TAI
  • Patent number: 11991823
    Abstract: The present disclosure is relates to a conductive film and a manufacturing method thereof. The conductive film includes a base layer, a TPU complex layer, a conductive layer and a TPU surface layer. The TPU complex layer includes a TPU heat-resistant layer and a TPU melting layer. The TPU heat-resistant layer is disposed on the TPU melting layer, and the TPU melting layer is disposed on the base layer. The conductive layer includes a conductive circuit disposed on the TPU heat-resistant layer. The TPU surface layer is disposed on the conductive layer. Utilizing the TPU complex layer, the conductive layer does not contact directly with the base layer to avoid breaking the conductive line of the conductive layer when the base layer is pulled. Therefore, the lifetime of the conductive film can be increased.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: May 21, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, I-Ju Wu, Chi-Ho Tien
  • Patent number: 11975243
    Abstract: The present disclosure is relates to a TPU ball structure and a manufacturing method thereof. The TPU ball structure includes a ball bladder layer, a yarn layer and a surface layer. The ball bladder layer is made of TPU material. The yarn layer is made of TPU material, and the yarn layer is disposed to cover the ball bladder layer. The surface layer is made of TPU material, and the surface layer is disposed to cover the yarn layer. The above layers of the TPU ball structure are made of TPU material to satisfy a requirement for environmental protection, and are recyclable. There is no need to use adhesive to adhere the above layers of the TPU ball structure. Therefore, the peeling strength between the layers of the TPU ball structure can be increased so that the whole peeling strength of the TPU ball structure can be increased.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: May 7, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai
  • Patent number: 11912837
    Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: February 27, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, Ming-Chen Chang
  • Publication number: 20240047255
    Abstract: A wafer alignment assembly is provided. The wafer alignment assembly includes: a first tapered wall extending in a first horizontal direction; a first spring wall attached to an inner surface of the first tapered wall; a first set of conveyor rollers configured to rotate; a second tapered wall extending in the first horizontal direction, wherein the first tapered wall and the second tapered wall are characterized by a tapered shape that facilitates entry of a wafer assembly; a second spring wall attached to an inner surface of the first tapered wall; and a second set of conveyor rollers configured to rotate.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Inventors: Chia-Ching Lee, Tung-Hsuan Tsai, Hsin-Tai Wang, Chen Liang Chang, Kuo Hui Chang, Chi-Chun Peng
  • Patent number: 11654661
    Abstract: A composite thermoplastic film and the manufacturing method are provided in the present invention. The method includes: providing a first structural layer and a second structural layer; performing a co-extrusion step to form a composite layer, in which to use a first extruding machine to perform the co-extrusion step, so the first structural layer is divided into a first thermal fuse film and a third thermal fuse film, and use a second extruding machine to perform the co-extrusion step, so the second structural layer is formed as a second thermal fuse film and disposed between the first thermal fuse film and the third thermal fuse film to form a composite layer; and performing a film-forming step, the composite layer is cooled to form a film through a forming wheel, and a rotating speed of the forming wheel can be controlled to acquire a desired thickness of the composite thermoplastic film.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: May 23, 2023
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai
  • Publication number: 20230128230
    Abstract: The present disclosure relates to an elastic hot glue having low processing temperature capability. The elastic hot glue includes a TPU glue layer. The melting point of the TPU glue layer is 60˜100° C. The elastic recovery rate of the TPU glue layer is 95-100%. The elastic hot glue of the present disclosure can be widely applied to low processing temperature. The product using the elastic hot glue of the present disclosure has high elasticity recovery, and strong peeling strength so as to avoid the damage of the product, and increase the life of the product and maintain the appearance of the product.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 27, 2023
    Inventors: CHIH-YI LIN, KUO-KUANG CHENG, CHI-CHIN CHIANG, WEN-HSIN TAI, SHENG HORNG GUO
  • Patent number: 11552545
    Abstract: A power converter with a negative current detection mechanism is provided. A negative current detecting circuit includes a first operational amplifier, a first transistor and a second transistor. A non-inverting input terminal of the first operational amplifier is connected to a second terminal of a sense resistor. An inverting input terminal of the first operational amplifier is connected to a first terminal of a first capacitor. Control terminals of the first and second transistors are connected to an output terminal of the first operational amplifier. A first terminal of the first transistor is connected to the second terminal of the sense resistor. A second terminal of the first transistor is grounded. A first terminal of the second transistor is connected to the inverting input terminal of the first operational amplifier and the first terminal of the first transistor. A second terminal of the second transistor is grounded.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: January 10, 2023
    Assignee: ANPEC ELECTRONICS CORPORATION
    Inventors: Hsin-Tai Lin, Tzu-Yang Yen
  • Publication number: 20230001673
    Abstract: A composite thermoplastic film and the manufacturing method are provided in the present invention. The method includes: providing a first structural layer and a second structural layer; performing a co-extrusion step to form a composite layer, in which to use a first extruding machine to perform the co-extrusion step, so the first structural layer is divided into a first thermal fuse film and a third thermal fuse film, and use a second extruding machine to perform the co-extrusion step, so the second structural layer is formed as a second thermal fuse film and disposed between the first thermal fuse film and the third thermal fuse film to form a composite layer; and performing a film-forming step, the composite layer is cooled to form a film through a forming wheel, and a rotating speed of the forming wheel can be controlled to acquire a desired thickness of the composite thermoplastic film.
    Type: Application
    Filed: March 7, 2022
    Publication date: January 5, 2023
    Inventors: CHIH-YI LIN, KUO-KUANG CHENG, CHI-CHIN CHIANG, WEN-HSIN TAI
  • Publication number: 20230001680
    Abstract: A thermoplastic film composed of a single-layer of thermally fuse film. The single-layer of thermally fuse film has a melting point of 50° C.-160° C. and a Shore hardness ranges from 40 A-80 A. The present invention also provides another thermoplastic film, which has a multi-layer structure and the multi-layer structure from bottom to top, there are first thermally fuse film, second thermal fuse and third thermally fuse film. The thickness ratio of the first thermally fuse film, the second thermally fuse film and the third thermally fuse film is 1:1-2:1, in which the thermally fuse film, the first thermally fuse film, the second thermally fuse film, and the third thermally fuse film are thermoplastic polyurethane respectively, and thermoplastic polyurethane contains aromatic functional group or with aliphatic functional group.
    Type: Application
    Filed: March 22, 2022
    Publication date: January 5, 2023
    Inventors: CHIH-YI LIN, KUO-KUANG CHENG, CHI-CHIN CHIANG, WEN-HSIN TAI
  • Publication number: 20220376599
    Abstract: A power converter with a negative current detection mechanism is provided. A negative current detecting circuit includes a first operational amplifier, a first transistor and a second transistor. A non-inverting input terminal of the first operational amplifier is connected to a second terminal of a sense resistor. An inverting input terminal of the first operational amplifier is connected to a first terminal of a first capacitor. Control terminals of the first and second transistors are connected to an output terminal of the first operational amplifier. A first terminal of the first transistor is connected to the second terminal of the sense resistor. A second terminal of the first transistor is grounded. A first terminal of the second transistor is connected to the inverting input terminal of the first operational amplifier and the first terminal of the first transistor. A second terminal of the second transistor is grounded.
    Type: Application
    Filed: July 30, 2021
    Publication date: November 24, 2022
    Inventors: HSIN-TAI LIN, TZU-YANG YEN
  • Patent number: 11443653
    Abstract: A method for skill learning is implemented using a system including a wearable device to be worn by a user, a storage unit, and a processor communicating with the wearable device and the storage unit. The storage unit stores a plurality of virtual reality modules in the storage unit, each of the virtual reality modules containing interactive data associated with learning a skill. The method includes: accessing the storage unit to load a selected one of the virtual reality modules; and controlling the wearable device to present the interactive data contained in the selected one of the virtual reality modules to the user in the form of a virtual environment.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: September 13, 2022
    Assignee: NATIONAL TAIWAN NORMAL UNIVERSITY
    Inventors: Jon-Chao Hong, Kai-Hsin Tai, Jian-Hong Ye
  • Publication number: 20220176388
    Abstract: A centrifuge device, including a base, a rotation platform, and a lock module, is provided. The rotation platform is disposed on the base and adapted to support a rotor of a centrifugal bowl. The rotor is rotatably connected to a stator of the centrifugal bowl. The lock module includes a main body, a lock assembly, and a positioning component. The main body is disposed on the base. The lock assembly is movably connected to the main body and located above the rotation platform. The lock assembly is adapted to be operated to a first state to lock the stator and a second state to be separated from the stator. The positioning component is movably connected to the main body. The positioning component is adapted to move to a first position to position the lock assembly to the first state and a second position to release the lock assembly.
    Type: Application
    Filed: August 16, 2021
    Publication date: June 9, 2022
    Applicant: Sangtech Lab Inc.
    Inventors: Cheng-Sheng Liang, Tao Liang, Hsin Tai Ke
  • Publication number: 20220096725
    Abstract: A centrifuge bowl is configured to separate a first component and a second component in a sample. The centrifuge bowl includes a shell, a core, a separation cavity, and a stator head. The shell includes an upper shell part, a middle shell part, a lower shell part, and a bottom shell part. The core is arranged in the shell. The separation cavity is arranged between the lower shell part and the core. The stator head is arranged on the shell and includes an input tube and an output tube. The sample enters the separation cavity via the input tube. When the shell and the core rotate on a rotation axis, the sample in the separation cavity is separated into the first component and the second component according to a magnitude of an inertial force. In addition, a blood centrifuge system including the above centrifuge bowl is provided.
    Type: Application
    Filed: June 22, 2021
    Publication date: March 31, 2022
    Applicant: Sangtech Lab Inc.
    Inventors: Cheng-Sheng Liang, Tao Liang, Hsin Tai Ke
  • Publication number: 20220041820
    Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.
    Type: Application
    Filed: August 2, 2021
    Publication date: February 10, 2022
    Inventors: CHIH-YI LIN, KUO-KUANG CHENG, CHI-CHIN CHIANG, WEN-HSIN TAI, MING-CHEN CHANG