Patents by Inventor Hsin-Tai Wang

Hsin-Tai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER ALIGNMENT ASSEMBLY OF THE SOLDER REFLOW SYSTEM
    Publication number: 20240047255
    Abstract: A wafer alignment assembly is provided. The wafer alignment assembly includes: a first tapered wall extending in a first horizontal direction; a first spring wall attached to an inner surface of the first tapered wall; a first set of conveyor rollers configured to rotate; a second tapered wall extending in the first horizontal direction, wherein the first tapered wall and the second tapered wall are characterized by a tapered shape that facilitates entry of a wafer assembly; a second spring wall attached to an inner surface of the first tapered wall; and a second set of conveyor rollers configured to rotate.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Inventors: Chia-Ching Lee, Tung-Hsuan Tsai, Hsin-Tai Wang, Chen Liang Chang, Kuo Hui Chang, Chi-Chun Peng