Patents by Inventor HSIN-TE CHIEN

HSIN-TE CHIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230383898
    Abstract: A bracket assembly includes a first bracket and a first lock bracket. The first bracket forms a plurality of first guide slots and a plurality of first locking holes, the first guide slot extends along a mounting direction, and a position of the first locking hole in the mounting direction is gradient; the first lock bracket is connected to the first bracket, and includes a first device connecting piece and a first bracket connecting piece, the first device connecting piece forms at least one first device locking hole thereon, the first bracket connecting piece is bent with respect to the first device connecting piece and forms a plurality of first lock holes. In addition, the disclosure further provides an electronic device including the above-mentioned bracket assembly.
    Type: Application
    Filed: July 15, 2022
    Publication date: November 30, 2023
    Inventor: HSIN-TE CHIEN
  • Patent number: 11470738
    Abstract: A fixing support includes first, second and third fixing units and limiting elements. The first fixing unit has a first slide groove extending in first direction. The second fixing unit includes a second-direction fixing portion and a second-direction sliding portion. The second-direction fixing portion has a second slide groove extending in second direction. The second-direction sliding portion is slidably disposed at the second slide groove. The third fixing unit includes a third-direction fixing portion and a third-direction sliding portion. The third-direction fixing portion has a third slide groove extending in third direction. The third-direction sliding portion is slidably disposed at the third slide groove. The limiting elements allow the first, second and third fixing units to slidably connect to each other and allow the first, second and third directions to be linearly independent of each other. An electronic device is further introduced.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: October 11, 2022
    Assignee: CINCOZE CO., LTD.
    Inventor: Hsin-Te Chien
  • Publication number: 20220272857
    Abstract: A fixing support includes first, second and third fixing units and limiting elements. The first fixing unit has a first slide groove extending in first direction. The second fixing unit includes a second-direction fixing portion and a second-direction sliding portion. The second-direction fixing portion has a second slide groove extending in second direction. The second-direction sliding portion is slidably disposed at the second slide groove. The third fixing unit includes a third-direction fixing portion and a third-direction sliding portion. The third-direction fixing portion has a third slide groove extending in third direction. The third-direction sliding portion is slidably disposed at the third slide groove. The limiting elements allow the first, second and third fixing units to slidably connect to each other and allow the first, second and third directions to be linearly independent of each other. An electronic device is further introduced.
    Type: Application
    Filed: May 14, 2021
    Publication date: August 25, 2022
    Inventor: HSIN-TE CHIEN
  • Publication number: 20220269320
    Abstract: A computation device includes an expandable host and an expansion module. The expandable host includes a host casing, a host circuit board, a computation unit and an electrical unit. The host casing has an opening. The host circuit board is disposed in the host casing and has a slot. The slot is disposed at the opening. The computation unit is disposed on the host circuit board. The electrical unit is disposed in the host casing and electrically connected to the host circuit board. The expansion module includes an expansion casing, an expansion circuit board and an expansion unit. The expansion circuit board is penetratingly disposed at the expansion casing and includes an insertion portion protruding from the expansion casing. The expansion unit is disposed in the expansion casing and electrically connected to expansion circuit board. The expansion unit includes a processor.
    Type: Application
    Filed: May 14, 2021
    Publication date: August 25, 2022
    Inventor: HSIN-TE CHIEN
  • Publication number: 20220272865
    Abstract: A dustproof heat-dissipating mechanism includes a casing, a thermally conductive component, a heat-dissipating component and a first fan. A dent portion is disposed on an outer lateral side of the casing and spaced apart from an electronic component storage space. The thermally conductive component is disposed in the casing. One end of the thermally conductive component is connected to the inner lateral side of the dent portion. The heat-dissipating component has a plurality of cooling fins disposed in the dent portion. The first fan is disposed at the dent portion and faces the heat-dissipating component. An electronic device with the dustproof heat-dissipating mechanism and an electronic component is further provided. The dustproof heat-dissipating mechanism is free from dust accumulation and easy to clean.
    Type: Application
    Filed: May 14, 2021
    Publication date: August 25, 2022
    Inventor: HSIN-TE CHIEN
  • Publication number: 20220264758
    Abstract: An electronic device support capable of grounding is disclosed. The electronic device support is adapted to fix an electronic device in place. The electronic device includes a panel and a support grounding element. The panel is for use in fixing a rear side of the electronic device in place. The support grounding element is disposed on the panel.
    Type: Application
    Filed: May 14, 2021
    Publication date: August 18, 2022
    Inventor: HSIN-TE CHIEN