Patents by Inventor Hsin-Ting Tsai
Hsin-Ting Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096781Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.Type: ApplicationFiled: March 20, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
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Patent number: 9857508Abstract: A color filter pattern including a plurality of color filters arranged in a pattern and the manufacturing method thereof are provided. By performing at least one two-stage exposure process to a color filter layer, the plurality of color filters are formed with a sharp profile.Type: GrantFiled: October 6, 2016Date of Patent: January 2, 2018Assignee: United Microelectronics Corp.Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee
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Patent number: 9738871Abstract: A method of extracting organelles from cells includes following process. A plurality of cells and a solution are mixed uniformly to obtain a mixture. The mixture is loaded into a container. The container is placed in a milling device comprising a miller and a mechanical power source connected to the miller. The miller is immersed into the mixture within the container. The mixture is milled by the miller to obtain a homogenized mixture, wherein a milling parameter is provided to the milling device, and the mechanical power source drives the miller according to the milling parameter. The homogenized mixture is centrifuged to obtain a supernatant. The supernatant is centrifuged to obtain a precipitate with a plurality of organelles. In the process that the mixture is milled by the miller, at least a part of the miller is kept in the mixture.Type: GrantFiled: September 3, 2015Date of Patent: August 22, 2017Assignee: TAIWAN MITOCHONDRION APPLIED TECHNOLOGY CO., LTD.Inventors: Chia-Wen Lin, Hsin-Ting Tsai, Han-Chung Cheng
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Publication number: 20170186795Abstract: An image sensor is provided in the present invention. The image sensor includes a continuous microlens including a plurality of top sub lenses connected with one another and a plurality of bottom sub lenses disposed corresponding to the top sub lenses. The continuous microlens maybe used to enhance quantum efficiency. The top sub lens and the bottom sub lens condense light by two steps within a shorter distance and make the light focused on a sensing element, and the continuous microlens may be applied without the limitation about the size of the pixel region accordingly. Additionally, the sensitivity and the uniformity thereof may be enhanced because of the shorter distance between the bottom sub lens and the sensing element. A transmittance of a color filter layer disposed corresponding to the bottom sub lens may also be enhanced.Type: ApplicationFiled: January 12, 2016Publication date: June 29, 2017Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Hung-Sheng Chang
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Publication number: 20170023712Abstract: A color filter pattern including a plurality of color filters arranged in a pattern and the manufacturing method thereof are provided. By performing at least one two-stage exposure process to a color filter layer, the plurality of color filters are formed with a sharp profile.Type: ApplicationFiled: October 6, 2016Publication date: January 26, 2017Applicant: United Microelectronics Corp.Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee
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Patent number: 9539621Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.Type: GrantFiled: December 17, 2013Date of Patent: January 10, 2017Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang
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Patent number: 9507264Abstract: A color filter pattern including a plurality of color filters arranged in a pattern and the manufacturing method thereof are provided. By performing at least one two-stage exposure process to a color filter layer, the plurality of color filters are formed with a sharp profile.Type: GrantFiled: February 2, 2015Date of Patent: November 29, 2016Assignee: United Microelectronics Corp.Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee
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Publication number: 20160257924Abstract: A method of extracting organelles from cells includes following process. A plurality of cells and a solution are mixed uniformly to obtain a mixture. The mixture is loaded into a container. The container is placed in a milling device comprising a miller and a mechanical power source connected to the miller. The miller is immersed into the mixture within the container. The mixture is milled by the miller to obtain a homogenized mixture, wherein a milling parameter is provided to the milling device, and the mechanical power source drives the miller according to the milling parameter. The homogenized mixture is centrifuged to obtain a supernatant. The supernatant is centrifuged to obtain a precipitate with a plurality of organelles. In the process that the mixture is milled by the miller, at least a part of the miller is kept in the mixture.Type: ApplicationFiled: September 3, 2015Publication date: September 8, 2016Inventors: Chia-Wen Lin, Hsin-Ting Tsai, Han-Chung Cheng
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Publication number: 20160223912Abstract: A color filter pattern including a plurality of color filters arranged in a pattern and the manufacturing method thereof are provided. By performing at least one two-stage exposure process to a color filter layer, the plurality of color filters are formed with a sharp profile.Type: ApplicationFiled: February 2, 2015Publication date: August 4, 2016Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee
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Patent number: 8707974Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.Type: GrantFiled: December 11, 2009Date of Patent: April 29, 2014Assignee: United Microelectronics Corp.Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang
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Publication number: 20140096800Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.Type: ApplicationFiled: December 17, 2013Publication date: April 10, 2014Applicant: UNITED MICROELECTRONICS CORP.Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang
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Patent number: 8137901Abstract: A method for fabricating an image sensor is disclosed. First, a semiconductor substrate is provided, in which a photosensitive region is defined on the semiconductor substrate. At least one photosensitive material is then formed on the semiconductor substrate, and a first exposure process is performed to form a tapered pattern in the photosensitive material. A second exposure process is performed to form a straight foot pattern in the photosensitive material, and a developing process is performed to remove the tapered pattern and straight foot pattern to form the photosensitive material into a plurality of photosensitive blocks. A reflow process is conducted thereafter to form the photosensitive blocks into a plurality of microlenses.Type: GrantFiled: May 28, 2008Date of Patent: March 20, 2012Assignee: United Microelectronics Corp.Inventors: Hsin-Ting Tsai, Cheng-Hung Yu
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Patent number: 8084289Abstract: A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region are sequentially formed on the substrate. A color filter array is formed on the first planarization layer in the pixel array region. A second planarization layer is formed to cover the color filter array and filled into the opening. A plurality of microlens is formed above the color filter array on the second planarization layer. A capping layer is conformally formed on the microlens and the second planarization layer. An etching step is performed to remove the capping layer and the second planarization layer in the opening so as to expose the patterned metal layer in the pad region.Type: GrantFiled: February 26, 2010Date of Patent: December 27, 2011Assignee: United Microelectronics Corp.Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Kun-Yen Hsu
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Publication number: 20110212567Abstract: A method of fabricating an image sensor device is provided. First, a substrate comprising a pixel array region and a pad region is provided. A patterned metal layer and a first planarization layer having an opening exposing the patterned metal layer in the pad region are sequentially formed on the substrate. A color filter array is formed on the first planarization layer in the pixel array region. A second planarization layer is formed to cover the color filter array and filled into the opening. A plurality of microlens is formed above the color filter array on the second planarization layer. A capping layer is conformally formed on the microlens and the second planarization layer. An etching step is performed to remove the capping layer and the second planarization layer in the opening so as to expose the patterned metal layer in the pad region.Type: ApplicationFiled: February 26, 2010Publication date: September 1, 2011Inventors: Hsin-Ting TSAI, Cheng-Hung Yu, Chin-Kuang Liu, Kun-Yen Hsu
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Publication number: 20110139188Abstract: A wafer cleaning device comprising a wafer stage for holding a wafer having a surface to be washed, a first nozzle positioned above the wafer, a second nozzle positioned above the wafer. A first height is between the first nozzle and the surface and a second height is between the second nozzle and the surface, wherein the first height is shorter than the second height.Type: ApplicationFiled: December 11, 2009Publication date: June 16, 2011Inventors: Hsin-Ting Tsai, Cheng-Hung Yu, Chin-Kuang Liu, Ming-Hsin Lee, Wei-Hong Chuang, Kuei-Chang Tung, Yan-Yi Lu, Chin-Chin Wang
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Publication number: 20090294888Abstract: A method for fabricating an image sensor is disclosed. First, a semiconductor substrate is provided, in which a photosensitive region is defined on the semiconductor substrate. At least one photosensitive material is then formed on the semiconductor substrate, and a first exposure process is performed to form a tapered pattern in the photosensitive material. A second exposure process is performed to form a straight foot pattern in the photosensitive material, and a developing process is performed to remove the tapered pattern and straight foot pattern to form the photosensitive material into a plurality of photosensitive blocks. A reflow process is conducted thereafter to form the photosensitive blocks into a plurality of microlenses.Type: ApplicationFiled: May 28, 2008Publication date: December 3, 2009Inventors: Hsin-Ting Tsai, Cheng-Hung Yu
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Patent number: 6132113Abstract: A developer cup. The developer cup includes a bed. A central spindle is vertically and rotatably coupled to a center of the bed through an end of the central spindle. A chuck is vertically coupled to an end of the central spindle opposite to the bed end. An upper coupling is coupled to the central spindle between the chuck and the bed, wherein the chuck. A lower coupling is moveably coupled to the central spindle between the upper coupling and the bed. The annular cup has an upper wheel and a lower wheel, wherein the upper wheel is aligned with the lower wheel, the upper wheel is coupled to the lower wheel through a plurality of the brackets, and the lower wheel is smaller than the upper wheel.Type: GrantFiled: May 6, 1999Date of Patent: October 17, 2000Assignee: United Integrated Circuits Corp.Inventors: Cheng-Hung Yu, Hsin-Min Lee, Yung-Chi Wu, Hsin-Ting Tsai