Patents by Inventor Hsin-Wei Tsai

Hsin-Wei Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12262566
    Abstract: An optoelectronic module, including a substrate, a covering member, a light emitting element, and a light receiving element, is provided. The covering member is disposed on the substrate and includes an upper cover portion, a peripheral sidewall portion connected to the upper cover portion, and an inside partition delimiting a first cavity and a second cavity. The first cavity is separated from the second cavity. The light emitting element is disposed on the substrate as corresponding to the first cavity. The light receiving element is disposed on the substrate as corresponding to the second cavity. The inside partition has a first inner wall surface located in the first cavity and a second inner wall surface located in the second cavity. A first protruded-recessed structure is formed on the first inner wall surface.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: March 25, 2025
    Assignee: Life-On Technology Corporation
    Inventors: Jui Lin Tsai, Chien Tien Wang, Shu-Hua Yang, Hsin Wei Tsai, You-Chen Yu
  • Patent number: 12255104
    Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.
    Type: Grant
    Filed: August 2, 2023
    Date of Patent: March 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Ching Lee, Hsin-Han Tsai, Shih-Hang Chiu, Tsung-Ta Tang, Chung-Chiang Wu, Hung-Chin Chung, Hsien-Ming Lee, Da-Yuan Lee, Jian-Hao Chen, Chien-Hao Chen, Kuo-Feng Yu, Chia-Wei Chen, Chih-Yu Hsu
  • Patent number: 12255196
    Abstract: Manufacturing method of semiconductor package includes following steps. Bottom package is provided. The bottom package includes a die and a redistribution structure electrically connected to die. A first top package and a second top package are disposed on a surface of the redistribution structure further away from the die. An underfill is formed into the space between the first and second top packages and between the first and second top packages and the bottom package. The underfill covers at least a side surface of the first top package and a side surface of the second top package. A hole is opened in the underfill within an area overlapping with the die between the side surface of the first top package and the side surface of the second top package. A thermally conductive block is formed in the hole by filling the hole with a thermally conductive material.
    Type: Grant
    Filed: July 31, 2023
    Date of Patent: March 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo
  • Publication number: 20250072051
    Abstract: An exemplary gate stack includes a gate dielectric (e.g., a high-k dielectric layer over an interfacial layer) and a gate electrode (e.g., a work function layer over the high-k dielectric layer, a cap over the work function layer, and a bulk fill layer over the cap). The gate stack wraps and/or surrounds a first semiconductor layer disposed over a second semiconductor layer. The gate dielectric and the work function layer (and not the cap and/or the bulk fill layer) fill a space between the first semiconductor layer and the second semiconductor layer. A ratio of oxygen in outer portions of the gate stack to inner portions of the gate stack may be about 1 to about 1.25. A thickness of the work function layer at inner portions of the gate stack may be less than a thickness of the work function layer at outer portions of the gate stack.
    Type: Application
    Filed: January 5, 2024
    Publication date: February 27, 2025
    Inventors: Chih-Wei LEE, Hsin-Han TSAI, Tai-Wei HWANG
  • Publication number: 20250038002
    Abstract: An exemplary method for forming a gate stack of a multigate device includes forming a gate dielectric over a channel layer and forming a gate electrode over the gate dielectric. Forming the gate electrode includes forming a work function layer over the gate dielectric and forming a cap over the work function layer. Forming the cap includes forming a metal nitride layer over the work function layer and forming a silicon-comprising layer over the metal nitride layer. Forming the gate electrode includes forming a fluorine-free tungsten layer over the silicon-comprising layer of the cap without breaking vacuum. Forming the fluorine-free tungsten layer over the silicon-comprising layer includes co-flowing a tungsten-comprising precursor (e.g., WCl5) and a hydrogen-comprising precursor (e.g., H2).
    Type: Application
    Filed: November 30, 2023
    Publication date: January 30, 2025
    Inventors: Chih-Wei Lee, Hsin-Han Tsai, You Tai Tsai
  • Patent number: 12199403
    Abstract: An electronic device is provided. The electronic device includes a substrate, a semiconductor unit, a wall, and a light-transmitting member. The semiconductor unit is mounted on the substrate. The wall is disposed on the substrate and surrounds the semiconductor unit. The wall includes two exterior wall components and two interior wall components. The two exterior wall components are spaced apart from each other, so that two gaps are formed between the two exterior wall components. The two gaps are in spatial communication with an installation area that is surrounded by the two exterior wall components. The two interior wall components are arranged in the installation area and spaced apart from each other. The two interior wall components correspond in position to the two gaps and respectively shade parts of the two gaps. The light-transmitting member is disposed on the wall and covered on the semiconductor unit.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 14, 2025
    Assignee: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, Shu-Hua Yang
  • Patent number: 11588074
    Abstract: A light source device includes a substrate, a light emitting unit, a frame, a light permeable member, and a metal shield. An upper electrode layer and a lower electrode layer of the substrate are respectively disposed on two opposite sides of the substrate, and are electrically coupled to each other. The light emitting unit is disposed on the upper electrode layer. The frame is disposed on the substrate and is arranged around the light emitting unit. The light permeable member is disposed on the frame and covers the light emitting unit. The metal shield is fixed to an inner side of the frame and is connected to the ground pad of the upper electrode layer. The metal shield is arranged around the outer side of the light emitting unit.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: February 21, 2023
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, Chien-Tien Wang, Shu-Hua Yang, Yu-Hung Su
  • Publication number: 20220293813
    Abstract: An optoelectronic module, including a substrate, a covering member, a light emitting element, and a light receiving element, is provided. The covering member is disposed on the substrate and includes an upper cover portion, a peripheral sidewall portion connected to the upper cover portion, and an inside partition delimiting a first cavity and a second cavity. The first cavity is separated from the second cavity. The light emitting element is disposed on the substrate as corresponding to the first cavity. The light receiving element is disposed on the substrate as corresponding to the second cavity. The inside partition has a first inner wall surface located in the first cavity and a second inner wall surface located in the second cavity. A first protruded-recessed structure is formed on the first inner wall surface.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 15, 2022
    Applicant: Lite-On Technology Corporation
    Inventors: Jui Lin Tsai, Chien Tien Wang, Shu-Hua Yang, Hsin Wei Tsai, You-Chen Yu
  • Publication number: 20220165475
    Abstract: An inductor module includes at least one first magnetic core, a second magnetic core and at least one winding assembly. Each first magnetic core includes a connection part, a first post and a second post. The first post and the second post are disposed on a top surface of the connection part. A winding groove is formed between the first post and the second post. The second magnetic core is disposed adjacent to the first magnetic core. Each winding assembly is formed by wrapping a single metal sheet for at least one turn. Each winding assembly is disposed around the first post. A portion of each winding assembly is accommodated within the winding groove of the corresponding first magnetic core. An overall thickness of the winding assembly within the winding groove is smaller than or equal to a width W of the winding groove and greater than 0.9×W.
    Type: Application
    Filed: August 4, 2021
    Publication date: May 26, 2022
    Inventors: Hsin-Wei Tsai, Te-Chih Peng, Min-Cheng Chiang
  • Publication number: 20220115837
    Abstract: An electronic device is provided. The electronic device includes a substrate, a semiconductor unit, a wall, and a light-transmitting member. The semiconductor unit is mounted on the substrate. The wall is disposed on the substrate and surrounds the semiconductor unit. The wall includes two exterior wall components and two interior wall components. The two exterior wall components are spaced apart from each other, so that two gaps are formed between the two exterior wall components. The two gaps are in spatial communication with an installation area that is surrounded by the two exterior wall components. The two interior wall components are arranged in the installation area and spaced apart from each other. The two interior wall components correspond in position to the two gaps and respectively shade parts of the two gaps. The light-transmitting member is disposed on the wall and covered on the semiconductor unit.
    Type: Application
    Filed: October 4, 2021
    Publication date: April 14, 2022
    Inventors: Hsin-Wei Tsai, Shu-Hua Yang
  • Patent number: 11262060
    Abstract: A light source device includes a substrate, an electrode layer and an annular step-like surrounding frame both disposed on the substrate, a light emitter and a light detector both spaced apart from each other and mounted on the electrode layer in the surrounding frame, and a light permeable member disposed on the surrounding frame. The surrounding frame includes an upper tread arranged away from the substrate, an upper riser connected to an inner edge of the upper tread, a lower tread arranged at an inner side of the upper riser, and a lower riser connected to an inner edge of the lower tread and arranged away from the upper tread. The surrounding frame has a notch recessed in the lower tread and the lower riser for spatially communicating an inner side of the surrounding frame to an external space.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: March 1, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, I-Ju Chen, Hou-Yen Tsao, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 11217572
    Abstract: The light source device includes a substrate, a light emitting unit mounted on the substrate, a frame disposed on the substrate, a metal shield fixed to an inner side of the frame and electrically coupled to the substrate, a light permeable member disposed on the frame, a cover plate disposed on the light permeable member and fixed to the frame, a detection unit electrically coupled to the substrate, and an uplift block that provides for the substrate to be disposed thereon.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: January 4, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, Jui-Lin Tsai, Chia-Cheng Wu, You-Chen Yu, Chien-Tien Wang, Tai-Wen Tsai, Pai-Hao Chang, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 11120936
    Abstract: A magnetic component module includes a magnetic core group, a first winding, a second winding, and a third winding. The magnetic core group includes a first magnetic core, a second magnetic core disposed corresponding to the first magnetic core, and a third magnetic core disposed corresponding to the second magnetic core. The second magnetic core is placed between the first magnetic core and the third magnetic core. The first winding and the second winding are placed between the first magnetic core and the second magnetic core. The third winding is placed in the third magnetic core. The first magnetic core, the second magnetic core, the first winding, and the second winding together constitute a transformer. The third magnetic core and the third winding constitute an inductive component. Therefore, less components are used, manufacturing is simplified, and production costs are reduced.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 14, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hsin-Wei Tsai, Hua-Sheng Lin, Ming-Cheng Lee
  • Patent number: 11035563
    Abstract: A light source device includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two opposite surfaces of the substrate, a plurality of first conductive posts and second conductive posts embedded in the substrate and having the same number, a light emitter, a surrounding frame surrounding the light emitter, and a light permeable member disposed on the surrounding frame and covering the light emitter. The first conductive posts connect a first upper electrode pad of the upper electrode layer and a first lower electrode pad of the lower electrode layer. The second conductive posts connect a second upper electrode pad of the upper electrode layer and a second lower electrode pad of the lower electrode layer. The light emitter is mounted on the first upper electrode pad and is electrically connected to the second upper electrode pad.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: June 15, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, I-Ju Chen, Hou-Yen Tsao, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 10895374
    Abstract: A light source device includes a substrate, an upper electrode layer and a lower electrode layer both respectively disposed on two opposite surfaces of the substrate, a light emitting unit mounted on the upper electrode layer, a surrounding frame disposed on the substrate and surrounding the light emitting unit, a conductive unit disposed on the surrounding frame, a light permeable member disposed on the surrounding frame and covering the light emitting unit, and a detecting circuit formed on an outer surface of the light permeable member. The lower electrode layer includes two coplanar sub-layers. The light emitting unit is electrically coupled to one of the two sub-layers through the upper electrode layer. The detecting circuit includes two contacts connected to the conductive unit, and is electrically coupled to the second lower electrode sub-layer by the conductive unit electrically coupled to the other one of the two sub-layers.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: January 19, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, I-Ju Chen, Hou-Yen Tsao, Chia-Cheng Wu, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 10866375
    Abstract: A light source device and an electronic apparatus are provided. The light source device includes a substrate, an electrode layer and a surrounding frame disposed on the substrate, a light emitter and a light detector mounted on the electrode layer and located inside of the surrounding frame, and a light permeable member disposed on the surrounding frame and covering the light emitter and the light detector. When the light emitter receives a predetermined current so as to emit an invisible light toward the light permeable member, the light detector receives a reflected part of the invisible light to generate an initial photocurrent. When the light emitter receives a manipulation current so that a detection photocurrent generated from the light detector is less than a first proportion of the initial photocurrent or greater than a second proportion of the initial photocurrent, the light emitter stops receiving the manipulation current.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: December 15, 2020
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, I-Ju Chen, Hou-Yen Tsao, Shu-Hua Yang, Yu-Hung Su
  • Publication number: 20200251461
    Abstract: The light source device includes a substrate, a light emitting unit mounted on the substrate, a frame disposed on the substrate, a metal shield fixed to an inner side of the frame and electrically coupled to the substrate, a light permeable member disposed on the frame, a cover plate disposed on the light permeable member and fixed to the frame, a detection unit electrically coupled to the substrate, and an uplift block that provides for the substrate to be disposed thereon.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 6, 2020
    Inventors: Hsin-Wei Tsai, Jui-Lin Tsai, Chia-Cheng Wu, YOU-CHEN YU, CHIEN-TIEN WANG, TAI-WEN TSAI, Pai-Hao Chang, SHU-HUA YANG, YU-HUNG SU
  • Publication number: 20200251618
    Abstract: A light source device includes a substrate, a light emitting unit, a frame, a light permeable member, and a metal shield. An upper electrode layer and a lower electrode layer of the substrate are respectively disposed on two opposite sides of the substrate, and are electrically coupled to each other. The light emitting unit is disposed on the upper electrode layer. The frame is disposed on the substrate and is arranged around the light emitting unit. The light permeable member is disposed on the frame and covers the light emitting unit. The metal shield is fixed to an inner side of the frame and is connected to the ground pad of the upper electrode layer. The metal shield is arranged around the outer side of the light emitting unit.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 6, 2020
    Inventors: Hsin-Wei Tsai, CHIEN-TIEN WANG, SHU-HUA YANG, YU-HUNG SU
  • Publication number: 20200251458
    Abstract: A light source device includes a substrate, a light emitting unit, a frame, a light permeable member, a cover plate, and a detection unit. An upper electrode layer and a lower electrode layer of the substrate are respectively arranged on two opposite sides of the substrate, and are electrically coupled to each other. The light emitting unit is disposed on the upper electrode layer. The frame is disposed on the substrate and surrounds the light emitting unit. The light permeable member is disposed on the frame and covers the light emitting unit. The cover plate is disposed on the light permeable member and is fixed to the frame. The detection unit includes a detection circuit formed on the light permeable member or the cover plate and two transmission circuits formed on the frame. The detection circuit is electrically coupled to the upper electrode layer through the transmission circuits.
    Type: Application
    Filed: January 30, 2020
    Publication date: August 6, 2020
    Inventors: Hsin-Wei Tsai, SHU-HUA YANG, YU-HUNG SU
  • Patent number: D1015170
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: February 20, 2024
    Assignee: Garmin International, Inc.
    Inventors: Han-Wei Huang, Sean K. Stumpf, Todd P. Register, Jin-Ming Chen, Hsin Wei Tsai