Abstract: A semiconductor device includes a substrate, a heat dissipation dielectric layer, a conductive interconnect structure, and a blocking dielectric layer. The heat dissipation dielectric layer is disposed on the substrate and has a thermal conductivity greater than 10 W/mK. The conductive interconnect structure is disposed in the heat dissipation dielectric layer. The blocking dielectric layer is disposed in the heat dissipation dielectric layer to isolate the conductive interconnect structure from the heat dissipation dielectric layer.

Abstract: A method of manufacturing an interconnect structure includes forming an opening through a dielectric layer. The opening exposes a top surface of a first conductive feature. The method further includes forming a barrier layer on sidewalls of the opening, passivating the exposed top surface of the first conductive feature with a treatment process, forming a liner layer over the barrier layer, and filling the opening with a conductive material. The liner layer may include ruthenium.

Abstract: A method of manufacturing an interconnect structure includes forming an opening through a dielectric layer. The opening exposes a top surface of a first conductive feature. The method further includes forming a barrier layer on sidewalls of the opening, passivating the exposed top surface of the first conductive feature with a treatment process, forming a liner layer over the barrier layer, and filling the opening with a conductive material. The liner layer may include ruthenium.

Abstract: An interconnection structure, along with methods of forming such, are described. The interconnection structure includes a first portion of a conductive layer, a second portion of the conductive layer disposed adjacent the first portion of the conductive layer, and a dielectric foam disposed between the first and second portions of the conductive layer. The dielectric foam includes fluid gaps filled with carbon dioxide gas.

Abstract: The present disclosure relates to an integrated chip comprising a substrate. A first conductive wire is over the substrate. A second conductive wire is over the substrate and is adjacent to the first conductive wire. A first dielectric cap is laterally between the first conductive wire and the second conductive wire. The first dielectric cap laterally separates the first conductive wire from the second conductive wire. The first dielectric cap includes a first dielectric material. A first cavity is directly below the first dielectric cap and is laterally between the first conductive wire and the second conductive wire. The first cavity is defined by one or more surfaces of the first dielectric cap.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first interconnect dielectric layer arranged over a substrate, a second interconnect dielectric layer arranged over the first interconnect dielectric layer, and an interconnect conductive structure arranged within the second interconnect dielectric layer. The interconnect conductive structure includes an outer portion that has a first conductive material. Further, the interconnect conductive structure includes a central portion having outermost sidewalls surrounded by the outer portion of the interconnect conductive structure. The central portion includes a second conductive material different than the first conductive material.

Abstract: A display device including a substrate, a cholesteric liquid crystal layer, and a transparent electrode layer that are sequentially stacked is provided. The cholesteric liquid crystal layer includes cholesteric liquid crystal molecules and a plurality of transparent photoresist structures. Each of the transparent photoresist structures is a closed structure, and the cholesteric liquid crystal molecules are respectively accommodated in a plurality of patterned areas respectively surrounded by the transparent photoresist structures, so as to form a plurality of cholesteric liquid crystal patterns. The transparent electrode layer includes a plurality of sub-electrodes. The cholesteric liquid crystal patterns are respectively driven by the sub-electrodes. An orthogonal projection of each of the transparent photoresist structures on the substrate falls in an orthogonal projection of a corresponding sub-electrode of the sub-electrodes on the substrate.

Abstract: The present disclosure relates to an integrated chip comprising a substrate. A first conductive wire is over the substrate. A second conductive wire is over the substrate and is adjacent to the first conductive wire. A first dielectric cap is laterally between the first conductive wire and the second conductive wire. The first dielectric cap laterally separates the first conductive wire from the second conductive wire. The first dielectric cap includes a first dielectric material. A first cavity is directly below the first dielectric cap and is laterally between the first conductive wire and the second conductive wire. The first cavity is defined by one or more surfaces of the first dielectric cap.

Abstract: In a method of manufacturing a semiconductor device a semiconductor wafer is retrieved from a load port. The semiconductor wafer is transferred to a treatment device. In the treatment device, the surface of the semiconductor wafer is exposed to a directional stream of plasma wind to clean a particle from the surface of the semiconductor wafer. The stream of plasma wind is generated by an ambient plasma generator and is directed at an oblique angle with respect to a perpendicular plane to the surface of the semiconductor wafer for a predetermined plasma exposure time. After the cleaning, a photo resist layer is disposed on the semiconductor wafer.

Abstract: An interconnection structure, along with methods of forming such, are described. The interconnection structure includes a first portion of a conductive layer, a second portion of the conductive layer disposed adjacent the first portion of the conductive layer, and a dielectric foam disposed between the first and second portions of the conductive layer. The dielectric foam includes fluid gaps filled with carbon dioxide gas.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes includes a first insulating layer formed over a semiconductor substrate and conductive vias formed in the first insulating layer. The conductive structure also includes conductive lines and air gaps alternately formed over the first insulating layer. The conductive lines are correspondingly aligned to the conductive vias. The conductive structure further includes capping layers correspondingly covering the plurality of air gaps.

Abstract: The present invention relates to an automatic sheet-feeding scanning apparatus having a movable guide rib device. The automatic sheet-feeding scanning apparatus includes a flatbed scanner and an automatic document feeder. The movable guide rib device is mounted in a housing of the flatbed scanner and includes a guide rib structure, at least one hollow portion, a plurality of elastic members and a fixing plate. The guide rib structure is movable upwardly or downwardly so as to avoid document damage even if the document is relatively large-sized.

Abstract: A double-lens optical scanning device and method of using the same. Wherein, a housing of said optical scanning device is provided with a photograph cartridge insertion slot and a negative cartridge insertion slot, that can be inserted photograph-, negative-, or slide-to-be-scanned. Said housing comprises a light source, two optical lenses, and at least an image sensor. Said two optical lenses are provided with different light paths, such that said image sensor is utilized to determine a category of an object-to-be-scanned, in selecting said optical lens to be used and a direction of said light source. A switching circuit is utilized to switch said optical lens to be used, fetch an image of said object-to-be-scanned, and then focus it onto said image sensor to form said image, and convert it into digital data for output.

Abstract: A sheet pick-up device includes a sheet pick-up arm, a driving shaft and a collar. The sheet pick-up arm has a sleeve at the outside surface thereof. The driving shaft is penetrated through the sheet pick-up arm and the sleeve. The collar is sheathed around the driving shaft and includes at least one flexible vane in contact with the inner surface of the sleeve. The height of the flexible vane relative to the outer surface of the collar is greater than the radial distance between the outer surface of the collar and the inner surface of the sleeve.

Abstract: A document feeder includes a casing, a sheet pick-up module, a stopper and a swing lever. The casing includes a sheet feeding channel therein. The sheet pick-up module is pivotally mounted above the sheet feeding channel, and movable between a sheet feeding position and a standby position. The stopper is disposed under the sheet feeding channel. The swing lever includes a first end part is pressed down by the sheet pick-up module and a second end part is pressed down by the stopper. When the sheet pick-up module is switched from the sheet feeding position to the standby position, the sheet pick-up module depresses the first end part of the swing lever, so that the stopper is raised by the second end part of the swing lever to be protruded to the sheet feeding channel.

Abstract: The present invention relates to an automatic sheet-feeding scanning apparatus having a movable guide rib device. The automatic sheet-feeding scanning apparatus includes a flatbed scanner and an automatic document feeder. The movable guide rib device is mounted in a housing of the flatbed scanner and includes a guide rib structure, at least one hollow portion, a plurality of elastic members and a fixing plate. The guide rib structure is movable upwardly or downwardly so as to avoid document damage even if the document is relatively large-sized.

Abstract: The present invention relates to a sheet-feeding scanner including an automatic document feeder and an image scanning portion. The automatic document feeder includes a U-shaped transfer path, a first scanning window and a first scanning module. The U-shaped transfer path includes a sheet pick-up section, a sheet reverse region and a scan region. The first scanning window in disposed in the sheet reverse region. The first scanning module is arranged beside the first scanning window for scanning the image of a first side of the paper sheet. The image scanning portion is disposed under the automatic paper feeder, and includes a second scanning window and a second scanning module. The second scanning window is disposed in the scan region. The second scanning module is arranged under the second scanning window for scanning the image of a second side of the paper sheet.

Abstract: The present invention provides an automatic document feeder having a detachable sheet-pressing slice. The automatic document feeder is mounted on a scanning apparatus having a scanning window. By means of the automatic document feeder, multiple documents are successively transported across the scanning window of the scanning apparatus to perform the scanning operation. The automatic document feeder includes a casing and a sheet-feeding mechanism. The detachable sheet-pressing slice is disposed at a lower part of the sheet-feeding mechanism. In a case that the detachable sheet-pressing slice is damaged, only the detachable sheet-pressing slice needs to be detached from the automatic document feeder and replaced with a new one. As a consequence, the maintenance of the detachable sheet-pressing slice is very easy and speedy.

Abstract: A sheet pick-up device for use in a document feeder includes a driving shaft, a sheet pick-up arm and a spring clutch. The spring clutch includes a spring and a collar. A retractable claw segment is extended from the collar and sheathed by the spring.

Abstract: A document feeder includes a casing, a sheet pick-up module, a stopper and a swing lever. The casing includes a sheet feeding channel therein. The sheet pick-up module is pivotally mounted above the sheet feeding channel, and movable between a sheet feeding position and a standby position. The stopper is disposed under the sheet feeding channel. The swing lever includes a first end part is pressed down by the sheet pick-up module and a second end part is pressed down by the stopper. When the sheet pick-up module is switched from the sheet feeding position to the standby position, the sheet pick-up module depresses the first end part of the swing lever, so that the stopper is raised by the second end part of the swing lever to be protruded to the sheet feeding channel.