Abstract: The present disclosure provides a structure and a method to reduce electro-migration. An interconnect structure according to the present disclosure includes a conductive feature embedded in a dielectric layer, a capping barrier layer disposed over the conductive feature and the dielectric layer, and an adhesion layer sandwiched between the capping barrier layer and the dielectric layer. The adhesion layer includes a degree of crystallinity between about 40% and about 70%.

Abstract: A drawn fused filament fabrication method of three-dimensional printing is disclosed in which the filament extruded is variable and not restricted to the diameter of the nozzle used for extrusion. This method composes three steps. The first is to extrude a small amount of material at a starting position. Next, the extruding head pulls the extruded material along while moving away from the starting position. During this time to material cools down and solidifies. As a result, a thin filament is formed. Third, once the extruding head moves to a destination, a small amount of material can be extruded and deposited to anchor this newly formed filament to a surface. The drawn fused filament fabrication method may be used to print three-dimensional parts having significant lower thickness than the diameter of the nozzle used to extrude the printing material.

Abstract: Immobilized enzyme complexes (IEC) with enzymes that are non-covalently linked to matrices are provided along with methods for making the same. Methods of using the IEC for a wide variety of industrial enzymatic processes are also provided. Methods of converting cellulosic biomass and methods of effecting blood type conversions with the IEC are amongst the methods disclosed.