Abstract: An optical module includes a micro spectrometer. The micro spectrometer includes an optical crystal, a lens, and a photosensitive assembly. The optical crystal is configured to receive detection light and covert the detection light into interference light. The optical crystal is surrounded by a sleeve, the sleeve configured to fix a position of the optical crystal. The lens is configured for receiving the interference light and focusing the interference light. The photosensitive assembly is configured for imaging the interference light into an interference image. The optical module further comprises a controller. The controller is electrically connected to the photosensitive assembly, and the controller is used to convert the interference image into light wavelength signals and light intensity signals.

Abstract: A packaging structure includes a flexible circuit board, an image sensor, a reinforcing plate, and an adhesive layer. The flexible circuit board defines a first opening, a first connecting portion, and a second connecting portion. The image sensor includes a photosensitive area exposed in the first opening and a connection area electrically coupled with the first connecting portion through a conductive body. The reinforcing plate and the image sensor are located on a same side of the flexible circuit board. The adhesive layer covers edges of the image sensor and couples the image sensor to the flexible circuit board. A lens module and an electronic device comprising the packaging structure are also disclosed.

Abstract: An optical module includes a micro spectrometer. The micro spectrometer includes an optical crystal, a lens, and a photosensitive assembly. The optical crystal is configured to receive detection light and covert the detection light into interference light. The optical crystal is surrounded by a sleeve, the sleeve configured to fix a position of the optical crystal. The lens is configured for receiving the interference light and focusing the interference light. The photosensitive assembly is configured for imaging the interference light into an interference image. The optical module further comprises a controller. The controller is electrically connected to the photosensitive assembly, and the controller is used to convert the interference image into light wavelength signals and light intensity signals.

Abstract: A packaging structure for an image sensor used in an electronic device includes a flexible circuit board, a reinforcing plate, an image sensor, and an adhesive layer. The reinforcing plate is disposed on the flexible circuit board. The image sensor is disposed in the reinforcing plate. The adhesive layer bonds the flexible circuit board, the reinforcing plate, the image sensor and the conductor.

Abstract: The present disclosure relates to an imaging device. The imaging device includes a flexible printed circuit board, a first lens module, and a second lens module. The first lens module includes a first side. The second lens module includes a second side. The first side faces the second side, and defines glue receiving part. The first lens module and second the lens module are installed on the flexible printed circuit board side by side. The second side is adhered to the glue receiving part. The first lens module and the second lens module are adhered to each other through curing of curable adhesive in the glue receiving part.

Abstract: In a method for assembling a camera module, a sensor module, a lens holder, and a lens assembly are first provided. The sensor module includes a substrate and a sensor positioned on the substrate. The lens holder is positioned on the substrate and accommodates the sensor. The lens assembly is held in the lens holder. At least one of the lens holder and the lens assembly has a chamfer at an end thereof opposite to the substrate and located between the lens holder and the lens assembly. Then, curable adhesive is applied to the chamfer. The tilt of the lens is adjusted until the lens assembly is optically aligned with the sensor. The curable adhesive is cured.

Abstract: In a method for assembling a camera module, a sensor module, a lens holder, and a lens assembly are first provided. The sensor module includes a substrate and a sensor positioned on the substrate. The lens holder is positioned on the substrate and accommodates the sensor. The lens assembly is held in the lens holder. At least one of the lens holder and the lens assembly has a chamfer at an end thereof opposite to the substrate and located between the lens holder and the lens assembly. Then, curable adhesive is applied to the chamfer. The tilt of the lens is adjusted until the lens assembly is optically aligned with the sensor. The curable adhesive is cured.