Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.

Abstract: A package structure includes a first RDL, an adhesive layer and a first electronic component. Upper bumps and conductive pads are provided on a first upper surface and a first lower surface of the first RDL, respectively. The adhesive layer is located on the first upper surface of the first RDL and surrounds the upper bumps. The first electronic component is mounted on the adhesive layer and includes conductors which are visible from an active surface of the first electronic component and joined to the upper bumps, the active surface of the first electronic component faces toward the first upper surface of the first RDL. Two adhesive surfaces of the adhesive layer are adhered to the first upper surface of the first RDL and the active surface of the first electronic component, respectively.

Abstract: An electronic device includes a first component and a second component. The first component includes a first housing and a protrusion element. The first housing has a first cover plate, and the protrusion element is disposed on the first cover plate. The second component is rotationally assembled with the first component along a first direction. The second component includes a second housing, an elastic structure, and a switching element. The elastic structure has an elastic post. The second housing has a second cover plate having a through hole. One part of the elastic post passes through the through hole and is exposed on the second cover plate. The protrusion element moves along a first direction relative to the elastic structure, such that the elastic post is squeezed by the protrusion element to move along a second direction and presses the switching element.

Abstract: A chip package including a substrate having an upper surface, a lower surface, and a sidewall surface that is at the edge of the substrate is provided. The substrate includes a sensor device therein and adjacent to the upper surface thereof. The chip package further includes light-shielding layer disposed over the sidewall surface of the substrate and extends along the edge of the substrate to surround the sensor device. The chip package further includes a cover plate disposed over the upper surface of the substrate and a spacer layer disposed between the substrate and the cover plate. A method of forming the chip package is also provided.

Abstract: A chip package including a substrate having an upper surface, a lower surface, and a sidewall surface that is at the edge of the substrate is provided. The substrate includes a sensor device therein and adjacent to the upper surface thereof. The chip package further includes light-shielding layer disposed over the sidewall surface of the substrate and extends along the edge of the substrate to surround the sensor device. The chip package further includes a cover plate disposed over the upper surface of the substrate and a spacer layer disposed between the substrate and the cover plate. A method of forming the chip package is also provided.

Abstract: A rotating inflatable device includes a base having an outlet a top thereof and an inlet in a side of the base. A blower is received in the base and driven by a motor. A drive part is received in the base and includes a rotating rod which is driven by another motor via a speed reduction unit. A drum to which a lower opening is mounted includes an annular ring and a central part which is located at a center of the drum by a plurality of ribs connected between the annular ring and the central part. A top end of the rotating rod is co-axially connected to the central part. A central shaft composed of a plurality of sections has its a lower end connected to the central part. A top end of the central shaft extends through a top opening of the balloon and is connected to a plate which seals on the top opening of the balloon.

Abstract: A blower includes a casing for receiving a motor therein and the shaft of the motor extends through an opening in a top surface of the casing. A blade assembly is connected to the shaft and a cover is fixedly connected to the top surface of the casing and has an air outlet. The blade assembly is enclosed by the cover. Two recesses are defined in an outer periphery of the casing and a handle is connected to one of the two recesses, and an air inlet is defined in an inside of the other recess of the casing.

Abstract: A blower includes a casing for receiving a motor therein and the shaft of the motor extends through an opening in a top surface of the casing. A blade assembly is connected to the shaft and a cover is fixedly connected to the top surface of the casing and has an air outlet. The blade assembly is enclosed by the cover. Two recesses are defined in an outer periphery of the casing and a handle is connected to one of the two recesses, and an air inlet is defined in an inside of the other recess of the casing.