Patents by Inventor Hsin-Yi Chi

Hsin-Yi Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10702492
    Abstract: The invention provides a novel PPAR? activator, a pharmaceutical composition, a food or a drink, a food additive, a supplement and a method of producing these products. The PPAR? activator includes an extract of a koji that contains 9-hydroxy-10,12-octadecadienoic acid (9-HODE: 10E, 12E) or an active fraction of the extract, as an active ingredient.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: July 7, 2020
    Assignee: Marukome Co., Ltd.
    Inventors: Teruo Kawada, Tsuyoshi Goto, Haruya Takahashi, Hsin-Yi Chi, Noriyoshi Ichijo, Keiji Nakata
  • Patent number: 10600634
    Abstract: Methods for polishing semiconductor substrates are disclosed. The finish polishing sequence is adjusted based on a measured edge roll-off of an analyzed substrate.
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: March 24, 2020
    Assignee: GlobalWafers Co., Ltd.
    Inventors: Alex Chu, Hsin-Yi Chi, Francis Hung, Jones Yang, H. J. Chiu, J. W. Lu
  • Publication number: 20180015062
    Abstract: The invention provides a novel PPAR? activator, a pharmaceutical composition, a food or a drink, a food additive, a supplement and a method of producing these products. The PPAR? activator includes an extract of a koji that contains 9-hydroxy-10,12-octadecadienoic acid (9-HODE: 10E, 12E) or an active fraction of the extract, as an active ingredient.
    Type: Application
    Filed: February 2, 2016
    Publication date: January 18, 2018
    Inventors: Teruo KAWADA, Tsuyoshi GOTO, Haruya TAKAHASHI, Hsin-Yi CHI, Noriyoshi ICHIP, Keiji NAKATA
  • Publication number: 20170178890
    Abstract: Methods for polishing semiconductor substrates are disclosed. The finish polishing sequence is adjusted based on a measured edge roll-off of an analyzed substrate.
    Type: Application
    Filed: December 21, 2016
    Publication date: June 22, 2017
    Applicant: SunEdison Semiconductor Limited (UEN201334164H)
    Inventors: Alex Chu, Hsin-Yi Chi, Francis Hung, Jones Yang, H.J. Chiu, J.W. Lu