Patents by Inventor Hsin-Yi Hsieh

Hsin-Yi Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130145810
    Abstract: A manufacture method for a magnesium alloy product includes steps of: providing a mold comprising a upper mold and a lower mold, the upper mold having a punch, the lower mold having a cavity, the punch being adapted to be accommodated in the cavity; heating the mold so as to increase the temperature of the cavity to a determined degree; placing a magnesium alloy billet in the heated cavity; and compressing the upper and lower molds so as to drive the punch to deform the magnesium alloy billet to a magnesium alloy product having a shape corresponding to the cavity. The punch in the cavity and an inner wall of the cavity are configured to have a gap of 0.05 mm˜0.1 mm.
    Type: Application
    Filed: October 15, 2012
    Publication date: June 13, 2013
    Applicant: Fair Friend Green Technology Corporation
    Inventors: HSIN-YI HSIEH, KUN-PAO CHANG
  • Publication number: 20100181891
    Abstract: A package structure for solid-state lighting with low thermal resistance is revealed. A solid-state light is set on a circuit board with high thermal conductivity. A connection layer is used for binding the circuit board with high thermal conductivity and the heat sink substrate. A first attachment layer is set between the heat sink substrate and the connection layer; and a second attachment is set between the connection layer and the circuit board with high thermal conductivity. The connection layer is made of metals or metallic composite materials with high heat dissipation and low thermal expansion coefficients. Thereby, the thermal resistance is lower than the structures according to the prior art. In addition, the thermal stress produced between the heat sink substrate and the circuit board with high thermal conductivity can be buffered by the connection layer for increasing lifetime of the package structure according to the present invention.
    Type: Application
    Filed: January 18, 2010
    Publication date: July 22, 2010
    Inventors: Cheng-Shih Lee, Hsin-Yi Hsieh, Shen-Chang Lin, Chou-Chih Yin
  • Publication number: 20100103689
    Abstract: A lamp device includes a lamp housing embedded in an automobile body. The lamp housing has an outer housing part coupled to and disposed outwardly around an inner housing part. The outer housing part has a thermal conductivity coefficient less than that of the inner housing part. A transparent lamp cap is mounted to the lamp housing, is exposed from the automobile body, and cooperates with the inner housing part of the lamp housing to define a first inner space therebetween. A lighting module is disposed in the first inner space, and includes at least one light emitting diode.
    Type: Application
    Filed: October 23, 2009
    Publication date: April 29, 2010
    Applicant: BRIGHT LED ELECTRONICS CORP.
    Inventors: Cheng-Shih LEE, Hsin-Yi HSIEH, Chou-Chih YIN
  • Publication number: 20080220989
    Abstract: A method for manufacturing a biochip is provided. First, a first self-assembled monolayer is coated on a substrate. Next, a plurality of first biomedical molecular dots are formed on the first self-assembled monolayer by micro-titration technique. After the bonding reaction between the first biomedical molecular point and the first self-assembled monolayer, a second self-assembled monolayer is deposited on the surface of the first self-assembled monolayer by evaporation. The second self-assembled monolayer attached on the plurality of first biomedical molecular dots and the first self-assembled monolayer not bonded to the substrate are removed, so that the first biomedical molecular dots immobilized on the first self-assembled monolayer are exposed. Finally, a second biomedical molecular layer is immobilized on the exposed portions of the first biomedical molecular dots.
    Type: Application
    Filed: September 28, 2007
    Publication date: September 11, 2008
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Fan Gang Tseng, Hsin Yi Hsieh, Chun Lung Wu
  • Patent number: 5477734
    Abstract: A pyroelectric swirl indicator for measurement of swirl in flowing fluid comprising at least one pyroelectric substrate having at least one surface to which is applied a fluctuating heat input, the fluctuating heat input causing a fluctuating surface charge distribution in response to temperature fluctuations of the substrate. Spaced apart conductor elements for sensing the fluctuating surface charge on the surface of the substrate in the vicinity of the spaced apart conductor elements are provided, the differences in the charge fluctuations between the spaced apart conductor elements comprising an indication of swirl flow in the fluid, said spaced apart conductor elements disposed in a manner which enables measurement of orthogonal components of fluid flow.
    Type: Grant
    Filed: August 12, 1994
    Date of Patent: December 26, 1995
    Assignee: Gas Research Institute
    Inventors: Jay N. Zemel, Hsin-Yi Hsieh, Anita L. Spetz
  • Patent number: 5463899
    Abstract: A system and method for simultaneous measurement of thermal conductivity and the mass flow of a fluid comprising two conduits arranged in a concentric or bypass arrangement through which the fluid is flowing, a pyroelectric anemometer disposed within each of the two conduits, and a differential amplifier connected to each of the pyroelectric anemometers which generate a signal based upon flow of fluid through the conduits.
    Type: Grant
    Filed: August 12, 1994
    Date of Patent: November 7, 1995
    Assignee: Gas Research Institute
    Inventors: Jay N. Zemel, Hsin-Yi Hsieh