Patents by Inventor Hsin-Yi Kuo
Hsin-Yi Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240249494Abstract: An environment managing and monitoring system and a method using same are provided. The environment managing and monitoring system is configured to assist monitors to obtain real-time information of the monitoring field and control device in the monitoring field. The environmental managing and monitoring system includes at least one sub-system and a host system. The host system is configured to output a region of interest condition and a monitoring condition to the sub-system, wherein the sub-system is configured to generate monitoring results according to the monitoring conditions, and selects an image range from the captured wide-angle dynamic real-time images according to the region of interest condition.Type: ApplicationFiled: September 4, 2023Publication date: July 25, 2024Inventors: Yung-tai SU, Hsin-lung HSIEH, Yu-hsuan LIAO, Yu-min CHUANG, Pang-tzu LIU, Chun-yueh CHEN, Jia-hao LU, Cheng-ju HSUIEH, Ching-wei LEE, Tsung-hsun TSAI, Po-yuan KUO, Po-yi WU, Chen-wei CHOU
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Patent number: 11393937Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.Type: GrantFiled: December 28, 2020Date of Patent: July 19, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
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Publication number: 20220147835Abstract: A knowledge graph construction system and method are disclosed. The system generates a recommended subject entity, at least one recommended object entity, and at least one recommended relation for a piece of text data according to the text data and a plurality of triples. The system displays the recommended object entity and the recommended relation at a current paragraph of the text data according to the recommended subject entity for user to select. The system receives a confirmed message related to the recommended subject entity, a recommended object entity selected by user from the at least one recommended object entity, and a recommended relation selected by user from the at least one recommended relation. The system adds the recommended subject entity and the selected recommended object entity and recommended relation to the triples, and constructs a current knowledge graph by using the triples according to the confirmed message.Type: ApplicationFiled: December 3, 2020Publication date: May 12, 2022Inventors: Hsin-Yi KUO, Wen-Nan WANG, Jia-Wei KAO, Wen-Fa HUANG, Po-Hsien CHIANG, Fu-Jheng JHENG, Yi-Hsiu LEE, Yu-Chuan YANG
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Patent number: 11250035Abstract: A knowledge graph generating apparatus, method and non-transitory computer readable storage medium thereof are provided. The apparatus marks an entity-relationship of the template of goods information in the template of webpage according to the operating signal and generates an extraction rule set, wherein the template of webpage is one of multiple goods webpages and has a template format. The apparatus extracts a plurality of first product information of the first goods webpages according to the extraction rule set, wherein the first goods webpages have the template format and are selected from the goods webpages. The apparatus generates a classified goods information result through a product information classification model, wherein the product information classification model is generated based on the first product information and the entity-relationship of the template of goods information.Type: GrantFiled: November 30, 2018Date of Patent: February 15, 2022Assignee: INSTITUTE FOR INFORMATION INDUSTRYInventors: Hsin-Yi Kuo, You-Cyuan Yang, Wen-Fa Huang, Wen-Nan Wang, Ping-I Chen
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Publication number: 20210142117Abstract: An apparatus and method for verification of information are provided. The apparatus for verification of information includes a storage and a processor, wherein the storage and the processor are electrically connected with each other. The storage stores a reference knowledge graph. The processor generates a to-be-verified knowledge graph of a to-be-verified article by a knowledge graph engine. The processor generates a verified result of the to-be-verified article by comparing the to-be-verified knowledge graph and the reference knowledge graph. The knowledge graph engine may generate the reference knowledge graph by searching and labeling a plurality of related articles according to a plurality of reference articles that have been labeled.Type: ApplicationFiled: December 3, 2019Publication date: May 13, 2021Inventors: Ping-I CHEN, Wen-Nan WANG, Wen-Fa HUANG, Hsin-Yi KUO
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Publication number: 20210119064Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.Type: ApplicationFiled: December 28, 2020Publication date: April 22, 2021Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
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Patent number: 10879406Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.Type: GrantFiled: December 11, 2019Date of Patent: December 29, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
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Patent number: 10707361Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.Type: GrantFiled: September 24, 2019Date of Patent: July 7, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
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Publication number: 20200133962Abstract: A knowledge graph generating apparatus, method and non-transitory computer readable storage medium thereof are provided. The apparatus marks an entity-relationship of the template of goods information in the template of webpage according to the operating signal and generates an extraction rule set, wherein the template of webpage is one of multiple goods webpages and has a template format. The apparatus extracts a plurality of first product information of the first goods webpages according to the extraction rule set, wherein the first goods webpages have the template format and are selected from the goods webpages. The apparatus generates a classified goods information result through a product information classification model, wherein the product information classification model is generated based on the first product information and the entity-relationship of the template of goods information.Type: ApplicationFiled: November 30, 2018Publication date: April 30, 2020Inventors: Hsin-Yi KUO, You-Cyuan YANG, Wen-Fa HUANG, Wen-Nan WANG, Ping-I CHEN
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Publication number: 20200111923Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.Type: ApplicationFiled: December 11, 2019Publication date: April 9, 2020Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
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Patent number: 10553733Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.Type: GrantFiled: September 27, 2017Date of Patent: February 4, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
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Publication number: 20200020816Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.Type: ApplicationFiled: September 24, 2019Publication date: January 16, 2020Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo
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Publication number: 20180151759Abstract: The present disclosure relates to an integrated chip that has a light sensing element arranged within a substrate. An absorption enhancement structure is arranged along a back-side of the substrate, and an interconnect structure is arranged along a front-side of the substrate. A reflection structure includes a dielectric structure and a plurality of semiconductor pillars that matingly engage the dielectric structure. The dielectric structure and semiconductor pillars are arranged along the front-side of the substrate and are spaced between the light sensing element and the interconnect structure. The plurality of semiconductor pillars and the dielectric structure are collectively configured to reflect incident light that has passed through the absorption enhancement structure and through the light sensing element back towards the light sensing element before the incident light strikes the interconnect structure.Type: ApplicationFiled: September 27, 2017Publication date: May 31, 2018Inventors: Po-Han Huang, Chien Nan Tu, Chi-Yuan Wen, Ming-Chi Wu, Yu-Lung Yeh, Hsin-Yi Kuo