Abstract: The present invention sets forth an apparatus for supporting multiple digital display interface standards. In one embodiment, the apparatus includes a graphics processing unit (GPU) configured to determine a display device type of a display device that is in connection with a digital display interconnect, receive a display device information associated with the display device, and output a first data signal to the display device. The display device is of display port (DP) digital display interface standard and the digital display interconnect is of digital visual interface (DVI) digital display interface standard. The apparatus further includes a removable adaptor circuitry between the display device and the digital display interconnect.

Abstract: The present invention sets forth an apparatus for supporting multiple digital display interface standards. In one embodiment, the apparatus includes a graphics processing unit (GPU) configured to determine a display device type of a display device that is in connection with a digital display interconnect, receive a display device information associated with the display device, and output a first data signal to the display device. The display device is of display port (DP) digital display interface standard and the digital display interconnect is of digital visual interface (DVI) digital display interface standard. The apparatus further includes a removable adaptor circuitry between the display device and the digital display interconnect.

Abstract: One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.

Abstract: One embodiment of the present invention sets forth an electronic assembly, which comprises a printed circuit board having at least one opening, an electronic component mounted on a first side of the printed circuit board, and a thermal dissipation structure including at least one heat sink having a first surface and a second surface. The first surface includes a first region coupled with a surface of the electronic component, and one or more second region provided with at least a heat dissipating member that is exposed through the opening on a second side of the printed circuit board.