Patents by Inventor Hsin Yu HOU

Hsin Yu HOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128232
    Abstract: A semiconductor package includes a first semiconductor die, an encapsulant, a high-modulus dielectric layer and a redistribution structure. The first semiconductor die includes a conductive post in a protective layer. The encapsulant encapsulates the first semiconductor die, wherein the encapsulant is made of a first material. The high-modulus dielectric layer extends on the encapsulant and the protective layer, wherein the high-modulus dielectric layer is made of a second material. The redistribution structure extends on the high-modulus dielectric layer, wherein the redistribution structure includes a redistribution dielectric layer, and the redistribution dielectric layer is made of a third material. The protective layer is made of a fourth material, and a ratio of a Young's modulus of the second material to a Young's modulus of the fourth material is at least 1.5.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung-Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan
  • Publication number: 20240071888
    Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.
    Type: Application
    Filed: August 28, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Chang Lin, Yen-Fu Su, Chin-Liang Chen, Wei-Yu Chen, Hsin-Yu Pan, Yu-Min Liang, Hao-Cheng Hou, Chi-Yang Yu
  • Patent number: 10803606
    Abstract: A temporally consistent belief propagation system includes a disparity map buffer that provides a disparity map of a previous time; a belief propagation unit that generates an energy function according to a first image of a present time, a second image of the present time, a first image of the previous time and the disparity map of the previous time; and a disparity generating unit that generates a disparity map of the present time according to the energy function.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: October 13, 2020
    Assignees: National Taiwan University, Himax Technologies Limited
    Inventors: Hsin-Yu Hou, Sih-Sian Wu, Da-Fang Chang, Liang-Gee Chen
  • Publication number: 20200027220
    Abstract: A temporally consistent belief propagation system includes a disparity map buffer that provides a disparity map of a previous time; a belief propagation unit that generates an energy function according to a first image of a present time, a second image of the present time, a first image of the previous time and the disparity map of the previous time; and a disparity generating unit that generates a disparity map of the present time according to the energy function.
    Type: Application
    Filed: July 19, 2018
    Publication date: January 23, 2020
    Inventors: Hsin-Yu Hou, Sih-Sian Wu, Da-Fang Chang, Liang-Gee Chen
  • Patent number: 10245605
    Abstract: A liquid container includes a casing, at least two inner bottles for containing liquids, at least one pumping unit, a turnable selecting mechanism, and a top cover. The inner bottles are received in the casing and covered by the top cover. The selecting mechanism is operated to select one of the inner bottles to be pumped, and then the pumping unit is operated to pump out the liquid contained in the selected inner bottle through an outlet located on the top cover. Not only weight and volume for carrying these liquids can be decreased, but also convenience for accessing these liquids is improved by using the aforesaid liquid container.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: April 2, 2019
    Inventor: Hsin Yu Hou
  • Publication number: 20180056312
    Abstract: A liquid container includes a casing, at least two inner bottles for containing liquids, at least one pumping unit, a turnable selecting mechanism, and a top cover. The inner bottles are received in the casing and covered by the top cover. The selecting mechanism is operated to select one of the inner bottles to be pumped, and then the pumping unit is operated to pump out the liquid contained in the selected inner bottle through an outlet located on the top cover. Not only weight and volume for carrying these liquids can be decreased, but also convenience for accessing these liquids is improved by using the aforesaid liquid container.
    Type: Application
    Filed: August 21, 2017
    Publication date: March 1, 2018
    Inventor: Hsin Yu HOU