Abstract: A micro LED includes an n-type semiconductor layer, a p-type semiconductor layer, a transition structure, an active structure and a hole injection layer. The transition structure includes first to third transition units. The active structure includes an M number of quantum well structures. Each of the M number of quantum well structures includes a barrier layer and a well layer. The third transition unit includes a Q number of layer units each including a barrier layer and a well layer. In each of the Q number of layer units, the barrier layer has an Al concentration that is 1.2 to 3 times an Al concentration of the barrier layer of each 10 of the M number of quantum well structures. The hole injection layer has an Al concentration that is not greater than the Al concentration of the barrier layer of each of the M number of quantum well structures.

Abstract: A heat-shrinkable polyester film includes at least one polyester material made of at least one polyester forming composition which includes a dibasic carboxylic mixture and a diol mixture. The heat-shrinkable polyester film has a heat shrinkage rate of not lower than 25% in a shrinkage direction, which is measured by immersing the heat-shrinkable polyester film in hot water at 65° C. for 10 seconds. A method for producing the heat-shrinkable polyester film is also disclosed.

Abstract: An abutment assembly includes an abutment, an adjustable buffer member and an adhesive. There is an angle between an extending direction of the abutment and a Z-axis direction, and the angle is greater than or equal to 0 degrees and smaller than or equal to 30 degrees. The adjustable buffer member is closely connected to the abutment having a positioning structure. The adjustable buffer member includes an engaging structure, an inner side wall, a base portion and a grinding portion. The engaging structure is engaged with the positioning structure. The inner side wall has at least one inner annular groove corresponding to the engaging structure. The base portion has a base thickness which is smaller than or equal to 4 mm. The adhesive is connected between the abutment and the adjustable buffer member, and contained in the inner annular groove. The grinding portion is manufactured by the instrument.

Abstract: An abutment assembly includes an abutment, an adjustable buffer member and an adhesive. There is an angle between an extending direction of the abutment and a Z-axis direction, and the angle is greater than or equal to 0 degrees and smaller than or equal to 30 degrees. The adjustable buffer member is closely connected to the abutment having a positioning structure. The adjustable buffer member includes an engaging structure, an inner side wall, a base portion and a grinding portion. The engaging structure is engaged with the positioning structure. The inner side wall has at least one inner annular groove corresponding to the engaging structure. The base portion has a base thickness which is smaller than or equal to 4 mm. The adhesive is connected between the abutment and the adjustable buffer member, and contained in the inner annular groove. The grinding portion is manufactured by the instrument.

Abstract: A healing abutment assembly for disposing on an implant by an auxiliary tool includes a healing abutment and a connecting member. A body includes an accommodating space, a healing surrounding surface, a top surface and a bottom surface. The bottom surface is connected to the implant. The healing surrounding surface is connected between the top surface and the bottom surface. The accommodating space is communicated with the top surface and the bottom surface. An outline of the top surface is formed in a non-circular shape, and the healing surrounding surface is formed in a non-conical shape. A positioning structure is disposed on the top surface and removably connected to the auxiliary tool. The connecting member is removably connected to the body and the implant. The connecting member is passed through the body and disposed in the implant so as to fixedly connect the body to the implant.