Abstract: A package structure and a method of forming the same are provided. A method includes forming first electrical connectors and second electrical connectors on a first side of an interposer wafer. An integrated circuit die is bonded to the first side of the interposer wafer using the first electrical connectors. A stiffener structure is attached to the first side of the interposer wafer adjacent the integrated circuit die. The stiffener structure covers the second electrical connectors in a plan view. The integrated circuit die and the stiffener structure are encapsulated with a first encapsulant. The interposer wafer and the stiffener structure are singulated to form a stacked structure.

Abstract: A liquid crystal module includes a plate, a plurality of driving circuits formed on the plate, at least an opening formed on the back of the plate, a connector positioned in the opening, and a plurality of flexible circuit boards used to connect the driving circuits and the connector.

Abstract: A flat panel display. The flat panel display includes a frame, a panel, and a backlight unit. The panel is disposed in the frame. The backlight unit, disposed in the frame, comprises a plurality of optical films, a light source, a light guide plate, and a reflector surrounding the light source and the light guide plate. One of the optical films has a first end, and the reflector has a second end in the vicinity of the optical films, with the first end level with or facing the second end.