Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A handy weight for exercising is disclosed. The handy weight includes a hollow body having a top handle and a convex bottom. The body is formed with a handhole for a user to grip the handle. Furthermore, the handy weight has a fixed center of gravity sufficiently low enough to enable the body to define a stable equilibrium position, in which the handle is at the top of the body, and enable the body to recover to the stable equilibrium position after being placed away from the position on a bearing surface.

Abstract: A handy weight for exercising is disclosed. The handy weight includes a hollow body having a top handle and a convex bottom. The body is formed with a handhole for a user to grip the handle. Furthermore, the handy weight has a fixed center of gravity sufficiently low enough to enable the body to define a stable equilibrium position, in which the handle is at the top of the body, and enable the body to recover to the stable equilibrium position after being placed away from the position on a bearing surface.