Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

Abstract: A portable data accessing device and more particularly the use of multi-port interfaces on a data accessing device disclosed. The multi-port data accessing device includes an inner body, one or a plurality of moving-caps, one or a plurality of grips, a pump-action and one or a plurality of locking/releasing mechanisms.

Abstract: The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.

Abstract: Three-dimensional (3D) semiconductor devices and fabricating methods are provided. In some implementations, a disclosed semiconductor device comprises: an array of vertical transistors each comprising a semiconductor body extending in a vertical direction; a plurality of word lines each extending along a first lateral direction and comprising a plurality of gate structures of a row of the array of vertical transistors arranged in the first lateral direction; and a plurality of bit lines each extending along a second lateral direction different from the first lateral direction and comprising silicide.

Abstract: In a method for fabricating a semiconductor device, a stack of alternating insulating layers and sacrificial layers are formed over a substrate. A staircase having a plurality of steps are formed in the stack, where each of the plurality of steps has a tread and a riser and further includes a respective pair of the insulating layer and the sacrificial layer over the insulating layer of the respective step. A dielectric layer is formed along the treads and risers of the plurality of steps. The dielectric layer is doped with one or a combination of carbon, phosphorous, boron, arsenic, and oxygen. The sacrificial layers are further replaced with a conductive material to form word line layers that are arranged between the insulating layers. A plurality of word line contacts are formed to extend from the word line layers of the plurality of steps, and further extend through the dielectric layer.

Abstract: A wireless communication system and related wireless devices are disclosed. The wireless communication system includes: a source wireless device configured to operably insert an auto-pairing request and one or more source Bluetooth device addresses into one or more predetermined advertising packets to form one or more target advertising packets, and configured to operably transmit the target advertising packets; and a destination wireless device configured to operably receive and parser the target advertising packets to extract the auto-pairing request and the one or more source Bluetooth device addresses. The destination wireless device performs an auto-pairing procedure with the source wireless device according to the auto-pairing request and the one or more source Bluetooth device addresses to establish a Bluetooth bond with the source wireless device.

Abstract: The present disclosure relates to a surface-treated copper foil which exhibits excellent affinity for an active material layer that is applied to the copper foil in the manufacture of a negative electrode (anode), for use in secondary lithium-ion batteries. The copper foil is plated with chromium and zinc and subsequently subjected to an organic treatment. The surface-treated copper has a surface tension of 34 to 58 dyne/cm and a surface roughness (Rz) of 0.8 to 2.5 ?m, and comprises: (a) copper foil; (b) a zinc-chromium layer plated one or both sides of the copper foil, wherein the zinc content in the zinc-chromium layer is from 10 to 120 ?g/dm2 and the chromium content in the zinc-chromium layer is from 10 to 35 ?g/dm2; and (c) an organic hydrophobic layer applied to the zinc-chromium layer.

Abstract: An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.

Abstract: A Bluetooth service estimation apparatus and a Bluetooth service estimation method thereof are provided. The Bluetooth service estimation apparatus listens to data packets transmitted between the Bluetooth host and the remote Bluetooth device, and determines a Bluetooth service type between the Bluetooth host and the remote Bluetooth device according to contents of the data packets. The Bluetooth service estimation apparatus transmits the Bluetooth service type to a packet traffic arbitration module of a Wi-Fi host so that the Wi-Fi host determines a weight of network resources according to the Bluetooth service type, and decides a utilization rate of an antenna based on the weight of the network resources.

Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.

Abstract: A wireless communication system and related wireless devices are disclosed. The wireless communication system includes: a source wireless device configured to operably insert an auto-pairing request and one or more source Bluetooth device addresses into one or more predetermined advertising packets to form one or more target advertising packets, and configured to operably transmit the target advertising packets; and a destination wireless device configured to operably receive and parser the target advertising packets to extract the auto-pairing request and the one or more source Bluetooth device addresses. The destination wireless device performs an auto-pairing procedure with the source wireless device according to the auto-pairing request and the one or more source Bluetooth device addresses to establish a Bluetooth bond with the source wireless device.

Abstract: A Bluetooth remote control system and related transmitting-end Bluetooth device and receiving-end Bluetooth device are disclosed. The transmitting-end Bluetooth device includes: a Bluetooth transmitting circuit; a receiving interface configured to operably receive a user trigger signal; a packet generating circuit configured to operably insert a power on request into one or more predetermined advertising packets to form one or more target advertising packets; and a Bluetooth control circuit configured to operably control the Bluetooth transmitting circuit to transmit the one or more target advertising packets. Each of the predetermined advertising packets is an advertising indication (ADV_IND) packet, a non-connectable advertising indication (ADV_NONCONN_IND) packet, or a discoverable advertisement indication (ADV_DISCOVER_IND) packet.

Abstract: An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.

Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.

Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.

Abstract: A static voltage drop analyzing apparatus applied to a Multi-Threshold Complementary Metal-Oxide-Semiconductor (MTCMOS) transistor is provided. The static voltage drop analyzing apparatus includes a calculating module, a processing module, and a measuring module. The calculating module calculates a voltage drop tolerance according to the voltage drop characteristic of the MTCMOS transistor. The processing module selects a simulation metal layer corresponding to the voltage drop tolerance from a plurality of candidate simulation metal layers, and adds the simulation metal layer into the MTCMOS transistor. The measuring module measures the voltage drop of the simulation metal layer added into the MTCMOS transistor. The measured voltage drop of the simulation layer added into the MTCMOS is substantially the static voltage drop of the MTCMOS transistor.

Abstract: A chip with flexible pad sequence manipulation is provided. The chip can be a memory controller, and includes a hub unit. The hub unit, formed by a gate array, is placed in a hub region predetermined during placing and routing procedures, and is capable of supporting re-placing and re-routing for changing interior interconnections and a pad sequence of the chip.

Abstract: A Bluetooth service estimation apparatus and a Bluetooth service estimation method thereof are provided. The Bluetooth service estimation apparatus listens to data packets transmitted between the Bluetooth host and the remote Bluetooth device, and determines a Bluetooth service type between the Bluetooth host and the remote Bluetooth device according to contents of the data packets. The Bluetooth service estimation apparatus transmits the Bluetooth service type to a packet traffic arbitration module of a Wi-Fi host so that the Wi-Fi host determines a weight of network resources according to the Bluetooth service type, and decides a utilization rate of an antenna based on the weight of the network resources.

Abstract: A congestive placement preventing apparatus for modifying a circuit layout includes an analyzing module, a defining module and an extension module. The analyzing module performs a congestion analysis on the circuit layout to generate an analysis result. The defining module defines a congestion region and a share region adjacent to the congestion region on the circuit layout according to the analysis result. A density of electronic cells of the congestion region is higher than that of electronic cells of the share region. The extension module arranges a plurality of electronic cells in the congestion region to the congestion region and the share region, thereby reducing the density of electronic cells in the congestion region.

Abstract: A change point finding method applied to a logic circuit is provided. The method first defines an indication map and performs a functional equivalent check to judge whether the indication map is correct. When a result is confirmative, the method adds a trap to an RTL HDL of the logic circuit, so that a plurality of comparing points are generated in an APR gate level HDL of the logic circuit. Then the method performs a backward functional equivalent check on the APR gate level HDL of the logic circuit to find a change point according to the comparing points.