Abstract: A chiplet system and a positioning method thereof are provided. The positioning method of the chiplet system includes the following steps. Two end chiplets and a plurality of middle chiplets are classified. A quantity calculation packet is transmitted and accumulated from each of the end chiplets towards another end to analyze a quantity of middle chiplets. A serial number comparison packet is transmitted and accumulated from each of the middle chiplets connected to one of the end chiplets towards another end to set a starting point. An identify number setting packet is transmitted and accumulated from the middle chiplet set as the starting point towards another end to set a positioning number of each of the middle chiplets.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: A trigger device used in single shooting and double shooting of a nail driver comprises a machine body having a safety device at a front end of the machine body; a switch having an eccentric shaft pivotally installed to the machine body and an adjusting body pivotally installed to the eccentric shaft; and a triggering device having a trigger, a movable inner sheet and an elastomer. One end of the trigger is pivotally installed to the eccentric shaft of the switch; and another end of the trigger is pivotally to the movable inner sheet which resists against the eccentric shaft. The elastomer is installed to a valve rod and resists against the movable inner sheet. When the safety rod and the trigger are pressed, by the interaction of the safety device, switch and the triggering device, the nail driver is operated to beat nail one time or several times continuously.