Patents by Inventor Hsing-Cheng LIN

Hsing-Cheng LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955428
    Abstract: A semiconductor structure includes a substrate, a conductive via and a first insulation layer. The conductive via is through the substrate. The first insulation layer is between the substrate and the conductive via. A first surface of the first insulation layer facing the substrate and a second surface of the first insulation layer facing the conductive via are extended along different directions.
    Type: Grant
    Filed: February 6, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsin-Hung Chen, Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Patent number: 11942368
    Abstract: Methods and devices of having an enclosure structure formed in a multi-layer interconnect and a through-silicon-via (TSV) extending through the enclosure structure. In some implementations, a protection layer is formed between the enclosure structure and the TSV.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Publication number: 20240096784
    Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 21, 2024
    Inventors: Meng-Hsien Lin, Hsing-Chih Lin, Ming-Tsong Wang, Min-Feng Kao, Kuan-Hua Lin, Jen-Cheng Liu, Dun-Nian Yaung, Ko Chun Liu
  • Publication number: 20240087988
    Abstract: The present disclosure, in some embodiments, relates an integrated chip. The integrated chip includes a substrate. A through-substrate-via (TSV) extends through the substrate. A dielectric liner separates the TSV from the substrate. The dielectric liner is along one or more sidewalls of the substrate. The TSV includes a horizontally extending surface and a protrusion extending outward from the horizontally extending surface. The TSV has a maximum width along the horizontally extending surface.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Hung-Ling Shih, Wei Chuang Wu, Shih Kuang Yang, Hsing-Chih Lin, Jen-Cheng Liu
  • Patent number: 10985625
    Abstract: A motor stator structure includes a core and plural hairpin wires. The core has slots, an insertion side, and an extension side. Each slot has an innermost layer, a second inner layer, a second outer layer and an outermost layer configured in a radial direction of the core. The hairpin leg protruding from the innermost layer extends for a first span distance, the hairpin leg protruding from the second inner layer extends for a second span distance, the hairpin leg protruding from the second outer layer extends for a third span distance, and the hairpin leg protruding from the outermost layer extends for a fourth span distance. The first span distance is different from the second span distance. The third span distance is different from the fourth span distance. The first and fourth span distances are substantially the same. The second and third span distances are substantially the same.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: April 20, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hong-Cheng Sheu, Hsing-Cheng Lin, Chia-Hsing Chien, Yi-No Chen
  • Publication number: 20200112218
    Abstract: A motor stator structure includes a core and plural hairpin wires. The core has slots, an insertion side, and an extension side. Each slot has an innermost layer, a second inner layer, a second outer layer and an outermost layer configured in a radial direction of the core. The hairpin leg protruding from the innermost layer extends for a first span distance, the hairpin leg protruding from the second inner layer extends for a second span distance, the hairpin leg protruding from the second outer layer extends for a third span distance, and the hairpin leg protruding from the outermost layer extends for a fourth span distance. The first span distance is different from the second span distance. The third span distance is different from the fourth span distance. The first and fourth span distances are substantially the same. The second and third span distances are substantially the same.
    Type: Application
    Filed: June 24, 2019
    Publication date: April 9, 2020
    Inventors: Hong-Cheng SHEU, Hsing-Cheng LIN, Chia-Hsing CHIEN, Yi-No CHEN
  • Patent number: 10404123
    Abstract: A stator is applied in an electrical motor. The stator includes a hollow iron core and a plurality of coil windings. The hollow iron core has two opposite surfaces and a plurality of accommodating spaces communicated with the surfaces. The accommodating spaces are arranged in an annular pattern. Each of the coil windings includes a plurality of wires winded via the accommodating spaces. Portions of the wires of the coil windings located in the accommodating spaces are radially concentrically arranged to form a plurality of winding layers. In at least one of the accommodating spaces, a wire cross-sectional area of the wire of the innermost one of the winding layers is smaller than a wire cross-sectional area of the wire of the outermost one of the winding layers.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: September 3, 2019
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hong-Cheng Sheu, Hsing-Cheng Lin, Chia-Hsing Chien
  • Publication number: 20180152070
    Abstract: A stator is applied in an electrical motor. The stator includes a hollow iron core and a plurality of coil windings. The hollow iron core has two opposite surfaces and a plurality of accommodating spaces communicated with the surfaces. The accommodating spaces are arranged in an annular pattern. Each of the coil windings includes a plurality of wires winded via the accommodating spaces. Portions of the wires of the coil windings located in the accommodating spaces are radially concentrically arranged to form a plurality of winding layers. In at least one of the accommodating spaces, a wire cross-sectional area of the wire of the innermost one of the winding layers is smaller than a wire cross-sectional area of the wire of the outermost one of the winding layers.
    Type: Application
    Filed: July 26, 2017
    Publication date: May 31, 2018
    Inventors: Hong-Cheng SHEU, Hsing-Cheng LIN, Chia-Hsing CHIEN