Abstract: A light guide device and a backlight module. The backlight module comprises a light guide device and a plurality of light sources. The light guide device comprises a housing, comprising a frame around the housing; and a light guide plate, integrated inside the frame and comprising a light-emitting surface on one side of the light guide plate inside the frame and a light-receiving surface on one edge of the light guide plate, wherein a plurality of slots are disposed between the light guide plate and the frame and on other edges different from the edge whereon the light-receiving surface is disposed, and each of a plurality of barriers is disposed on an inner side of the light guide plate while being adjacent to one of the plurality of slots. The barriers are capable of reflecting the light traveling toward the frame back to the backlight module to improve the light efficiency.

Abstract: A light guide device and a backlight module. The backlight module comprises a light guide device and a plurality of light sources. The light guide device comprises a housing, comprising a frame around the housing; and a light guide plate, integrated inside the frame and comprising a light-emitting surface on one side of the light guide plate inside the frame and a light-receiving surface on one edge of the light guide plate, wherein a plurality of slots are disposed between the light guide plate and the frame and on other edges different from the edge whereon the light-receiving surface is disposed, and each of a plurality of barriers is disposed on an inner side of the light guide plate while being adjacent to one of the plurality of slots. The barriers are capable of reflecting the light traveling toward the frame back to the backlight module to improve the light efficiency.

Abstract: An optical display module includes a liquid crystal panel, a driving IC, a flexible printed circuit board, a plurality of first pads, a plurality of second pads, at least a light source and a heat conductive member. The driving IC is provided on the liquid crystal panel and electrically connected to the flexible printed circuit board. The flexible printed circuit board includes through holes open at opposite sides. The first and second pads are provided on the opposite sides of the flexible printed circuit board respectively and connected to each other through the through holes. The light source electrically connected to the first pads. The heat conductive member is attached on the second pads. Heat of the light source is conducted to the heat conductive member through the first pads and the second pads in sequence to reduce the temperature around the light source.

Abstract: The present invention provides a method of ITO layout to make IC bear the high-volt electro static discharge, wherein the major steps include: designing the suitable circuit impedance and Layout at the position of Driver IC bonding and Interface on LCD Module(COG type) in accordance with the function and use of each pin; improving the protection function of ESD(Electro Static Discharge) in increasing the LCD Module assembly on the product of the client; wherein: connecting the pins of all VDD or VSS together at the bottom of the IC and the width of ITO layout spreading over the bottom of IC without influencing the layout of other pins after connecting VSS or VDD. Discharge the static electricity that enters the position of Module Interface and dissipate the electro static discharge by means of the ITO layout design of the big area to improve the protection ability of IC for the electro static discharge. Serial connect an extremely high impedance(3K˜50K ?) in the Reset Pin.

Abstract: The present invention provides a method of ITO layout to make IC bear the high-volt electro static discharge, wherein the major steps include: designing the suitable circuit impedance and Layout at the position of Driver IC bonding and Interface on LCD Module(COG type) in accordance with the function and use of each pin; improving the protection function of ESD(Electro Static Discharge) in increasing the LCD Module assembly on the product of the client; wherein: connecting the pins of all VDD or VSS together at the bottom of the IC and the width of ITO layout spreading over the bottom of IC without influencing the layout of other pins after connecting VSS or VDD. Discharge the static electricity that enters the position of Module Interface and dissipate the electro static discharge by means of the ITO layout design of the big area to improve the protection ability of IC for the electro static discharge. Serial connect an extremely high impedance(3K˜50K&OHgr;) in the Reset Pin.