Abstract: A semiconductor structure includes a first gate structure, a second gate structure coupled to the first gate structure, a source region, a first drain region, and a second drain region. The source region is surrounded by the first gate structure and the second gate structure. The first drain region is separated from the source region by the first gate structure. The second drain region is separated from the source region by the second gat structure. A shape of the first drain region and a shape of the second drain region are different from each other from a plan view.

Abstract: A clamping module is adapted to clamp a memory module and insert or remove the memory module into/from a slot. The clamping module includes a main body, two jaw clamps and a blocking pressing plate. The two jaw clamps are movably disposed on the main body and adapted to move in relative to each other to clamp or release the memory module. The blocking pressing plate is movably disposed on the main body, wherein after the two jaw clamps clamp the memory module to a position in contact with the slot, the two jaw clamps moves away from each other so that the memory module is released and the blocking pressing plate moves from a first position to a second position in order to press the memory module so that the memory module is inserted into the slot.

Abstract: A clamping module is adapted to clamp a memory module and insert or remove the memory module into/from a slot. The clamping module includes a main body, two jaw clamps and a blocking pressing plate. The two jaw clamps are movably disposed on the main body and adapted to move in relative to each other to clamp or release the memory module. The blocking pressing plate is movably disposed on the main body, wherein after the two jaw clamps clamp the memory module to a position in contact with the slot, the two jaw clamps moves away from each other so that the memory module is released and the blocking pressing plate moves from a first position to a second position in order to press the memory module so that the memory module is inserted into the slot.