Patents by Inventor Hsing-Hung Lee
Hsing-Hung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250122034Abstract: A paper feeding tray includes a base body, two through holes, two paper guiding elements pivotally disposed in the two through holes, and two elastic elements. The two through holes penetrate through the base body along an up-down direction. An inner portion of a shaft hole of a front inner wall of each through hole extends inward and then expands transversely to form an eccentric hole. Two sides of an inner portion of a shaft which is protruded from a front surface of each paper guiding element transversely extend oppositely to form an eccentric element. The two eccentric elements of the two paper guiding elements are rotatably accommodated in the two eccentric holes of the two through holes. The two elastic elements abut against the two eccentric elements.Type: ApplicationFiled: April 30, 2024Publication date: April 17, 2025Inventors: Kuo Shing Wang, Hsing Hung Lee
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Publication number: 20250106331Abstract: A scanner with a foldable stand includes a housing, a first output tray fodably covered to an upper portion of a rear of the housing, a second output tray foldably covered to a top of the housing, a supporting stand and an abutting element. Two ends of the first output tray have a starting end, and a swingable connecting end connected to the starting end. An outer surface of the first output tray is recessed inward to form a holding groove. Two ends of the second output tray have a pivot end pivotally connected to the connecting end, and a swingable terminal end connected with a free end of the pivot end. The supporting stand is foldably fastened in the holding groove. The abutting element is formed at a middle of the connecting end. The abutting element contacts with an inner portion of the supporting stand.Type: ApplicationFiled: April 25, 2024Publication date: March 27, 2025Inventors: Kuo Shing Wang, Hsing Hung Lee
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Patent number: 10841441Abstract: A scanning device includes an outer shell, a glass platform, a contact image sensor, a paper feeding unit and an upper cover. An inside of the outer shell has an accommodating space. The glass platform is disposed to the outer shell. The glass platform includes an automatic paper fed and scanned area, and a static paper scan area. The contact image sensor is disposed in the accommodating space. The paper feeding unit is disposed to a top surface of the automatic paper fed and scanned area. The upper cover is pivotally disposed to a top surface of the static paper scan area. A top surface of the upper cover is recessed downward to form a paper loading groove.Type: GrantFiled: October 30, 2019Date of Patent: November 17, 2020Assignee: Foxlink Image Technology Co., Ltd.Inventors: Chi Wen Chen, Wei Xiang Tsai, Hsing Hung Lee, Yi Hsuan Lin
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Publication number: 20200262665Abstract: A paper separation structure includes: an actuating unit being selectable to generate a forward and reverse actuating torque (T); a one-way actuator connected to said actuating unit and being able to break the connection of said actuating unit while said actuating unit generates a reverse actuating torque (T); a breaking unit having a threshold of breaking torque (TL1), and said braking torque (TL1) set lower than said actuating torque (T); and a separating roller connected to said one-way actuator and said braking unit to receive said actuating torque (T) and said braking torque (TL1). With the combination of components mentioned above, the paper separation structure of the present invention has a plurality of torque thresholds for paper separation and can switch between active and passive separation modes according to requirements.Type: ApplicationFiled: May 24, 2019Publication date: August 20, 2020Inventors: Hsing Hung Lee, Wei Xiang Tsai
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Publication number: 20200169642Abstract: A scanning device includes an outer shell, a glass platform, a contact image sensor, a paper feeding unit and an upper cover. An inside of the outer shell has an accommodating space. The glass platform is disposed to the outer shell. The glass platform includes an automatic paper fed and scanned area, and a static paper scan area. The contact image sensor is disposed in the accommodating space. The paper feeding unit is disposed to a top surface of the automatic paper fed and scanned area. The upper cover is pivotally disposed to a top surface of the static paper scan area. A top surface of the upper cover is recessed downward to form a paper loading groove.Type: ApplicationFiled: October 30, 2019Publication date: May 28, 2020Inventors: Chi Wen Chen, Wei Xiang Tsai, Hsing Hung Lee, Yi Hsuan Lin
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Patent number: 8981540Abstract: A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant. As such, when the carrier is disposed on a circuit board, the dielectric material is sandwiched between the lower side of the carrier and the circuit board to form a decoupling capacitor, thereby improving the power integrity.Type: GrantFiled: June 20, 2013Date of Patent: March 17, 2015Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Cheng-Yu Chiang, Wen-Jung Chiang, Hsing-Hung Lee
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Publication number: 20140225241Abstract: A package structure is disclosed, which includes: a carrier having a recessed portion formed on a lower side thereof and filled with a dielectric material; a semiconductor element disposed on an upper side of the carrier and electrically connected to the carrier; and an encapsulant formed on the upper side of the carrier for encapsulating the semiconductor element. Therein, the dielectric material is exposed from the encapsulant. As such, when the carrier is disposed on a circuit board, the dielectric material is sandwiched between the lower side of the carrier and the circuit board to form a decoupling capacitor, thereby improving the power integrity.Type: ApplicationFiled: June 20, 2013Publication date: August 14, 2014Inventors: Cheng-Yu Chiang, Wen-Jung Chiang, Hsing-Hung Lee
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Patent number: 8613340Abstract: An anti-rollover motorized vehicle includes a chassis, a front wheel and a rear two wheels assembly including a tilting base and a four-bar linkage structure. The tilting base is connected to the chassis through a supporting structure. The four-bar linkage structure suitable for connecting the chassis with two rear wheels includes first, second, third and fourth linkages. The first and second linkages are pivoted to the tilting base. The third and fourth linkages pivoted to two ends of the first and second linkages respectively are connected to the supporting brackets of the two rear wheels respectively. When the chassis is tilted, the tilting base and the supporting structure are also tilted, the first and second linkages are maintained at a constant angle relative to a road surface, and the third and fourth linkages are also tilted, such that track width of the two tilting rear wheels is maintained.Type: GrantFiled: June 30, 2011Date of Patent: December 24, 2013Assignee: National Taiwan University of Science and TechnologyInventors: Mau-Pin Hsu, Jyun-Jie Lin, Hsing-Hung Lee, Hsin-Wei Su
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Publication number: 20130001001Abstract: An anti-rollover motorized vehicle includes a chassis, a front wheel and a rear two wheels assembly including a tilting base and a four-bar linkage structure. The tilting base is connected to the chassis through a supporting structure. The four-bar linkage structure suitable for connecting the chassis with two rear wheels includes first, second, third and fourth linkages. The first and second linkages are pivoted to the tilting base. The third and fourth linkages pivoted to two ends of the first and second linkages respectively are connected to the supporting brackets of the two rear wheels respectively. When the chassis is tilted, the tilting base and the supporting structure are also tilted, the first and second linkages are maintained at a constant angle relative to a road surface, and the third and fourth linkages are also tilted, such that track width of the two tilting rear wheels is maintained.Type: ApplicationFiled: June 30, 2011Publication date: January 3, 2013Applicant: National Taiwan University of Science and TechnologyInventors: Mau-Pin Hsu, Jyun-Jie Lin, Hsing-Hung Lee, Hsin-Wei Su
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Patent number: 7184852Abstract: Provided are a system and method for automatically tracking a lot being moved between first and second manufacturing lines during semiconductor manufacturing. In one example, the method includes assigning a first state to the lot to indicate the lot's presence in the first manufacturing line. A trigger event indicating that the lot has been moved to the second manufacturing line may be identified, and a second state may be determined for the lot to reflect the lot's presence in the second manufacturing line. The second state may then be assigned to the lot.Type: GrantFiled: April 7, 2004Date of Patent: February 27, 2007Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsing-Hung Lee, King-Chuan Sun, You-Wei Shen, Yao-Chin Lee
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Publication number: 20050228527Abstract: Provided are a system and method for automatically tracking a lot being moved between first and second manufacturing lines during semiconductor manufacturing. In one example, the method includes assigning a first state to the lot to indicate the lot's presence in the first manufacturing line. A trigger event indicating that the lot has been moved to the second manufacturing line may be identified, and a second state may be determined for the lot to reflect the lot's presence in the second manufacturing line. The second state may then be assigned to the lot.Type: ApplicationFiled: April 7, 2004Publication date: October 13, 2005Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsing-Hung Lee, King-Chuan Sun, You-Wei Shen, Yao-Chin Lee
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Patent number: 6704659Abstract: In general, the present invention provides a seismic emergency response system (SERS) to control fabrication equipment and material flow for prevention of damage to wafers and equipment within a wafer fabrication plant during an earthquake. The SERS having a facility manager control system having one or a plurality of seismic detection devices, and at least one voting logic device for outputting an alarm triggering signal to a computer integrated manufacturing system; and a computer integrated manufacturing system having an emergency response system and an equipment server (tool application program) for sending a pause equipment command to an associated piece of equipment and a hold lot command to a material execution system to prevent damage of wafers during an earthquake. Optionally provided is one or a plurality of false alarm prevention devices and one or a plurality of enabling switches provided to selectively enable or disable the SERS.Type: GrantFiled: August 14, 2002Date of Patent: March 9, 2004Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Yuk-Tong Lee, Hsing-Hung Lee
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Publication number: 20040034476Abstract: In general, the present invention provides a seismic emergency response system (SERS) to control fabrication equipment and material flow for prevention of damage to wafers and equipment within a wafer fabrication plant during an earthquake. The SERS having a facility manager control system having one or a plurality of seismic detection devices, and at least one voting logic device for outputting an alarm triggering signal to a computer integrated manufacturing system; and a computer integrated manufacturing system having an emergency response system and an equipment server (tool application program) for sending a pause equipment command to an associated piece of equipment and a hold lot command to a material execution system to prevent damage of wafers during an earthquake. optionally provided is one or a plurality of false alarm prevention devices and one or a plurality of enabling switches provided to selectively enable or disable the SERS.Type: ApplicationFiled: August 14, 2002Publication date: February 19, 2004Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Yuk-Tong Lee, Hsing-Hung Lee