Patents by Inventor Hsing-Kai CHENG

Hsing-Kai CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9305687
    Abstract: A resistor device includes a resistor plate having opposite first and second surfaces; a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite first and second sides, respectively; and a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer. A protective layer is preferably provided, overlying the resistor plate and the first metal layer uncovered by the second metal layer.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: April 5, 2016
    Assignee: CYNTEC CO., LTD.
    Inventors: Hsing-Kai Cheng, Yu-Jen Lin, Yen-Ting Lin, Ta-Wen Lo
  • Patent number: 9024204
    Abstract: A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: May 5, 2015
    Assignee: Cyntec Co., Ltd.
    Inventors: Yen-Ting Lin, Dar-Win Lo, Sung-Chan Yen, Hsing-Kai Cheng
  • Publication number: 20140266568
    Abstract: A resistor device includes a resistor plate having opposite first and second surfaces; a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite first and second sides, respectively; and a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer. A protective layer is preferably provided, overlying the resistor plate and the first metal layer uncovered by the second metal layer.
    Type: Application
    Filed: May 30, 2014
    Publication date: September 18, 2014
    Applicant: CYNTEC CO. LTD.
    Inventors: Hsing-Kai CHENG, Yu-Jen Lin, Yen-Ting Lin, Ta-Wen Lo
  • Publication number: 20130025915
    Abstract: A resistive device includes a resistive layer, a flexible substrate arranged on the resistive layer, and an electrode layer. The electrode layer includes two electrode sections arranged below the resistive layer and separate to each other. Moreover, a method for manufacturing the resistive device with flexible substrate is also disclosed.
    Type: Application
    Filed: July 12, 2012
    Publication date: January 31, 2013
    Inventors: Yen-Ting LIN, Dar-Win LO, Sung-Chan YEN, Hsing-Kai CHENG