Abstract: A manufacturing method of a packaging structure of electronic components is provided, and includes the steps of: providing a substrate including at least an electronic component and a grounding area; covering the electronic component of the substrate with a molding unit; cutting out the molding unit to form a plurality of recessed spaces, wherein the recessed spaces are arranged around the electronic component and at least one of the recessed spaces is electrically connected to the grounding area of the substrate; and forming a plurality of columnar electromagnet barriers in the recessed spaces and an electromagnet barrier layer on an upper surface of the molding unit. A packaging structure of electronic components manufactured by the aforementioned method is also provided.