Abstract: A chip package includes a semiconductor substrate and a metal layer. The semiconductor substrate has an opening and a sidewall surrounding the opening, in which an upper portion of the sidewall is a concave surface. The semiconductor substrate is made of a material including silicon. The metal layer is located on the semiconductor substrate. The metal layer has plural through holes above the opening to define a MEMS (Microelectromechanical system) structure, in which the metal layer is made of a material including aluminum.

Abstract: A vehicle seat attachment latch assembly (24) includes a latch (40) mounted for movement between latched and unlatched positions with respect to a striker (29) to secure and selectively release a vehicle seat with respect to a vehicle body. A latching wedge (48) is mounted on the latch (40) for movement therewith and for movement with respect thereto in cooperation with a bias (54) provided by a first spring (58) that moves a wedging surface 52 of the latching wedge (48) into wedging contact with the striker (29) with the latch (40) in its latched position in order to provide a rattle free attachment. A locking pawl (70) and a spring (78) cooperate to hold the latch (40) in its latched position or permit release thereof for movement to the unlatched position where the striker (29) is released.