Abstract: A three-dimensional gas-liquid dual phase heat dissipation device includes a vapor chamber module and a water-cooling head. The vapor chamber module includes a vapor chamber. The vapor chamber includes a first cover plate, a second cover plate and a side wall surrounding the first cover plate and the second cover plate to form a hollow chamber therein. The first cover plate is used to contact a heat source, and the water-cooling head is fixed on the second cover plate of the vapor chamber.

Abstract: A liquid cooling device includes a water cooling radiator, a first pump and a cold plate. The water cooling radiator has a first surface and a second surface, the first surface and the second surface are located on opposite sides of the water cooling radiator, the first pump is disposed on the first surface or the second surface of the water cooling radiator, and the cold plate is disposed on the second surface of the water cooling radiator.