Abstract: A method of sample preparation for transmission electron microscope analysis is disclosed. The method renders a typical TEM analysis on a sample having a photoresist layer practical. The method uses a conductive layer and a dielectric layer to protect a photoresist layer of the TEM sample from slicing damage and ion bombardment. The conductive layer and the dielectric layer can also isolate the photoresist layer from moisture and oxygen containing environments and prevent the photoresist layer from shrinking. Moreover, the entire TEM sample preparation process need not use any organic solvent or water to clean the sample.

Abstract: A fabrication method for a transmission electron microscope (TEM) slide is described. A die having device structures formed thereon is provided. A thermal adhesive fills the surface of device structures formed on the die. The thermal adhesive is covered by a glass piece. A polishing step is performed to a non-device side of the die to form a thin sheet from the die. The glass piece is removed to expose the thermal adhesive. A sacrificial layer is then formed above the exposed thermal adhesive on the thin sheet. A slicing step is performed to form a TEM slide from the thin sheet.

Abstract: A method of sample preparation for transmission electron microscope analysis is disclosed. The method renders a typical TEM analysis on a sample having a photoresist layer practical. The method uses a conductive layer and a dielectric layer to protect a photoresist layer of the TEM sample from slicing damages and ion bombardments. The conductive layer and the dielectric layer can also isolate the photoresist layer from moisture and oxygen-contained environments and prevent the photoresist layer from shrinking. Moreover, the entire TEM sample preparation process need not use any organic solvent or water to clean the sample.

Abstract: A fabrication method for a transmission electron microscope (TEM) slideis described. A die having device structures formed thereon is provided A thermal adhesive fills the surface of device structures formed on the die. The thermal adhesive is covered by a glass piece. A polishing step is performed to form a slide from the die. The glass piece is removed to expose the thermal adhesive. A sacrificial layer is then formed above the exposed thermal adhesive on the slide. A slicing step is performed to form a TEM slide.