Abstract: Disclosed herein are composite polypeptide. According to various embodiments, the composite polypeptide includes a parent polypeptide and a metal binding motif capable of forming a complex with a metal cation. The composite polypeptide may be conjugated with a linker unit having a plurality of functional elements to form a multi-functional molecular construct. Alternatively, multiple composite polypeptides may be conjugated to a linker unit to form a molecular construct, or a polypeptide bundle. Linker units suitable for conjugating with the composite polypeptide having the metal binding motif are also disclosed.

Abstract: A non-volatile memory and a program method thereof are provided. The program method includes: setting one of a plurality of word lines to be a program word line, setting the word lines except the program word line to be a plurality of unselected word lines; raise a voltage on the program word line from a reference voltage to a first program voltage during a first sub-time period of a program time period; raising the voltage on the program word line from the first program voltage to a second program voltage during a second sub-time period of the program time period; and raising voltages on at least part of the unselected word lines from the reference voltage to a pass voltage during the second sub-time period.

Abstract: A non-volatile memory and a program method thereof are provided. The program method includes: setting one of a plurality of word lines to be a program word line, setting the word lines except the program word line to be a plurality of unselected word lines; raise a voltage on the program word line from a reference voltage to a first program voltage during a first sub-time period of a program time period; raising the voltage on the program word line from the first program voltage to a second program voltage during a second sub-time period of the program time period; and raising voltages on at least part of the unselected word lines from the reference voltage to a pass voltage during the second sub-time period.

Abstract: A non-volatile memory device driving method, applicable to a non-volatile memory device comprising a row decoder and a memory array, comprises: utilizing the row decoder to transmit multiple word line signals to multiple word lines of the memory array; according to an address, utilizing the row decoder to switch a selected word line signal of the multiple word line signals from a predetermined voltage level to a program voltage level; utilizing the row decoder to switch at least one support word line signal of the multiple word line signals from the predetermined voltage level to a first pass voltage level; when the selected word line signal is remained at the program voltage level, utilizing the row decoder to switch the at least one support word line signal from the first pass voltage level to a higher second pass voltage level.

Abstract: A non-volatile memory and a program method thereof are provided. The program method includes: selecting a programmed word line, where the programmed word line has a plurality of segments respectively corresponding to a plurality of bit lines; providing a program voltage to a voltage receiving end of the programmed word line, and sequentially transmitting the program voltage to the segments; respectively providing a plurality of bit line voltages to the bit lines at a plurality of enable time points and turning on a string selection switch at a setting time point; and setting voltage values of the bit line voltages according to the segments corresponding to the bit lines, respectively, or setting the enable time points according to the segments corresponding to the bit lines, or setting the setting time point according to a voltage transmission delay of the programmed word line.

Abstract: A programming method of a memory array is provided and includes following steps, wherein the memory array includes a target memory cell and two periphery memory cells electrically connected to a first word line. After a first programming operation is performed on the target memory cell, the target memory cell and the two periphery memory cells are verified to obtain a first verification result. Whether to perform a second programming operation or a third programming operation on the target memory cell is determined according to the first verification result. The step of performing the second programming operation or the third programming operation on the target memory cell includes: turning off a first transistor and a second transistor; and increasing a level of a passing voltage for turning on a plurality of non-target memory cells and a level of a programming voltage transmitted by the first word line.

Abstract: A method of programming a NAND flash memory cell string. The method includes a pre-boost stage configured to elevate channel voltage of a selected memory cell, and a boost stage is introduced after the pre-boost stage. The pre-boost stage has at least the following steps of biasing a bit line to a first voltage, biasing a string select transistor to a second voltage; and ramping down the string select transistor to the first voltage. In particular, the second voltage is higher than the first voltage.

Abstract: A method for programming memory cells includes applying a programming voltage to a selected memory cell in a memory cell array and a neighboring passing voltage to a neighboring memory cell next to the selected memory cell, increasing the programming voltage for programming the selected memory cell, and increasing the neighboring passing voltage for programming the selected memory cell.

Abstract: A method of programming a NAND flash memory cell string. The method includes a pre-boost stage configured to elevate channel voltage of a selected memory cell, and a boost stage is introduced after the pre-boost stage. The pre-boost stage has at least the following steps of biasing a bit line to a first voltage, biasing a string select transistor to a second voltage; and ramping down the string select transistor to the first voltage. In particular, the second voltage is higher than the first voltage.

Abstract: A flash memory device including a memory array, a row decoder and M page buffers is provided, wherein M is an integer greater than 2. The memory array includes a plurality of memory cells and is connected to a plurality of word lines and a plurality of bit lines. The row decoder drives a specific word line among the word lines during an enabling period. Each of the page buffers is connected to N bit lines of the bit lines, and N is an integer equal to or greater than 3. A jth page buffer drives an (N*(j?1)+1)th bit line to an (N*j)th bit line during the enabling period, and one of an (i?1)th bit line and an (i+1)th bit line is not driven when an ith bit line is not driven, wherein j is an integer and 1?j?M, and i is an integer and 1<i<M*N.

Abstract: A flash memory device including a memory array, a row decoder and M page buffers is provided, wherein M is a positive integer. The memory array includes a plurality of memory cells and is electrically connected to a plurality of word lines and a plurality of bit lines. The row decoder drives a specific word line among the word lines during an enabling period. The M page buffers divide the enabling period into N sub-periods, wherein N is an integer greater than 2. Furthermore, the ith, (i+N)th, (i+2N)th, . . . , (i+(M?1)*N)th bit lines are driven by the M page buffers during the ith sub-period, so as to program the memory cells electrically connected to the specific word line, wherein i is an integer and 1?i?N.

Abstract: A charge storage memory is configured in a NAND array, and includes NAND strings coupled to bit lines via string select switches and includes word lines. A controller is configured to produce a program bias pulse by biasing the bit lines and string select lines in a first condition; setting a word line coupled to a target cell to a first voltage level while the bit lines and string select lines are in the first condition; thereafter, biasing the bit lines and string select lines in a second condition; and setting the word line coupled to the target cell to a second voltage level higher than the first voltage level while the bit lines and string select lines are in the second condition. Program bias pulses produced in this manner can be used in a modulated incremental stepped pulse programming sequence.

Abstract: A temperature compensation circuit, applied on a metal oxide semiconductor (MOS) transistor, with a threshold voltage varying with respect to a temperature value of the MOS transistor, for having the MOS transistor corresponding to an equivalent threshold voltage substantially with a constant value throughout a temperature range, comprises a voltage generator. The voltage generator provides a voltage proportional to absolute temperature (VPTAT) to drive the body of the MOS transistor in such way that a variation of the threshold voltage due to temperature variation of the MOS transistor is substantially compensated with a variation of the threshold voltage due to body-source voltage variation of the MOS transistor, so that the MOS transistor corresponds to the equivalent threshold voltage that is temperature invariant.

Abstract: A charge storage memory is configured in a NAND array, and includes NAND strings coupled to bit lines via string select switches and includes word lines. A controller is configured to produce a program bias pulse by biasing the bit lines and string select lines in a first condition; setting a word line coupled to a target cell to a first voltage level while the bit lines and string select lines are in the first condition; thereafter, biasing the bit lines and string select lines in a second condition; and setting the word line coupled to the target cell to a second voltage level higher than the first voltage level while the bit lines and string select lines are in the second condition. Program bias pulses produced in this manner can be used in a modulated incremental stepped pulse programming sequence.

Abstract: A temperature compensation circuit, applied on a metal oxide semiconductor (MOS) transistor, with a threshold voltage varying with respect to a temperature value of the MOS transistor, for having the MOS transistor corresponding to an equivalent threshold voltage substantially with a constant value throughout a temperature range, comprises a voltage generator. The voltage generator provides a voltage proportional to absolute temperature (VPTAT) to drive the body of the MOS transistor in such way that a variation of the threshold voltage due to temperature variation of the MOS transistor is substantially compensated with a variation of the threshold voltage due to body-source voltage variation of the MOS transistor, so that the MOS transistor corresponds to the equivalent threshold voltage that is temperature invariant.

Abstract: A flash memory device including a memory array, a row decoder and M page buffers is provided, wherein M is a positive integer. The memory array includes a plurality of memory cells and is electrically connected to a plurality of word lines and a plurality of bit lines. The row decoder drives a specific word line among the word lines during an enabling period. The M page buffers divide the enabling period into N sub-periods, wherein N is an integer greater than 2. Furthermore, the ith, (i+N)th, (i+2N)th, . . . , (i+(M?1)*N)th bit lines are driven by the M page buffers during the ith sub-period, so as to program the memory cells electrically connected to the specific word line, wherein i is an integer and 1?i?N.

Abstract: An operation method of a non-volatile memory for reducing the second-bit effect in the non-volatile memory is suitable for an N-level memory cell having a first storage position and a second storage position (wherein N is a positive integer greater than 2). The method includes following steps: determining sets of operation levels for operating the first storage position according to the level of the second storage position; when the level of the second storage position is a lower level, operating the first storage position according to a first set of operation levels; when the level of the second storage position is a higher level, operating the first storage position according to a second set of operation levels. Each of the levels in the second set of operation levels is greater than the corresponding level in the first set of operation levels.

Abstract: A method for reducing leakage current of a semiconductor device includes supplying a substantially constant and non-zero bulk bias to a relatively low threshold voltage semiconductor device during formation of a conductive channel of the semiconductor device and during the formation of a non-conductive channel of the semiconductor device.

Abstract: An operation method of a non-volatile memory for reducing the second-bit effect in the non-volatile memory is suitable for an N-level memory cell having a first storage position and a second storage position (wherein N is a positive integer greater than 2). The method includes following steps: determining sets of operation levels for operating the first storage position according to the level of the second storage position; when the level of the second storage position is a lower level, operating the first storage position according to a first set of operation levels; when the level of the second storage position is a higher level, operating the first storage position according to a second set of operation levels. Each of the levels in the second set of operation levels is greater than the corresponding level in the first set of operation levels.

Abstract: A method for measuring intrinsic capacitance of a MOS device is provided. The MOS device includes a first terminal, a second terminal, a third terminal and a fourth terminal. First, provide a first input signal to the second terminal and ground the third terminal and fourth terminal. Then, charge the first terminal and measure a first current required for charging the first terminal. Afterward, provide a second input signal to the second terminal, ground the third terminal and the fourth terminal, and measure a second current required for charging the first terminal, wherein the first input signal and the second input signal have the same low level, but different high levels. Finally, determine intrinsic capacitance between the first terminal and the second terminal according to the first current, the second current and a high level difference between the first input signal and the second input signal.