Patents by Inventor Hsing-Wu Li

Hsing-Wu Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9443809
    Abstract: A portable apparatus, an IC packaging structure, an IC packaging object, and an IC packaging method thereof are disclosed. The IC packaging structure includes an IC packaging object and a substrate. The packaging object includes a die and a metallurgy layer. The die has a contact portion, a saw reserved portion, and a seal ring. The seal ring is disposed between the contact portion and the saw reserved portion. The metallurgy layer is disposed on the contact portion. At least a part of the metallurgy layer overlaps the seal ring. The metallurgy layer includes a solderable layer coated by a solder paste. The substrate includes a solder pad. The solder pad is coupled to the solderable layer coated by the solder paste.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: September 13, 2016
    Assignee: UPI SEMICONDUCTOR CORPORATION
    Inventors: Chau-Chun Wen, Hsing-Wu Li
  • Publication number: 20160027742
    Abstract: A portable apparatus, an IC packaging structure, an IC packaging object, and an IC packaging method thereof are disclosed. The IC packaging structure includes an IC packaging object and a substrate. The packaging object includes a die and a metallurgy layer. The die has a contact portion, a saw reserved portion, and a seal ring. The seal ring is disposed between the contact portion and the saw reserved portion. The metallurgy layer is disposed on the contact portion. At least a part of the metallurgy layer overlaps the seal ring. The metallurgy layer includes a solderable layer coated by a solder paste. The substrate includes a solder pad. The solder pad is coupled to the solderable layer coated by the solder paste.
    Type: Application
    Filed: June 5, 2015
    Publication date: January 28, 2016
    Inventors: Chau-Chun Wen, Hsing-Wu Li
  • Patent number: 7089983
    Abstract: A film sticking/testing equipment mainly includes a transmission mechanism, a film sticking apparatus and a test apparatus. The transmission mechanism is used for delivering at least a touch pad. The film sticking apparatus has a film release base to allow a protect film being released from a rolling belt, which temporarily adheres with the protect film. The protect film is attracted by the film sticking apparatus and adhered to the surface of the touch pad by way of vacuum suction. The testing apparatus provides a test rod traveling along a preset locus on the touch pad to take the output test value of the touch pad and input to the computer device such that the test value is compared with the preset value in the computer device to distinguish qualified touch pads from unqualified touch pads.
    Type: Grant
    Filed: February 24, 2004
    Date of Patent: August 15, 2006
    Assignee: Sentelic Corporation
    Inventor: Hsing-Wu Li
  • Publication number: 20050183498
    Abstract: A film sticking/testing equipment mainly includes a transmission mechanism, a film sticking apparatus and a test apparatus. The transmission mechanism is used for delivering at least a touch pad. The film sticking apparatus has a film release base to allow a protect film being released from a rolling belt, which temporarily adheres with the protect film. The protect film is attracted by the film sticking apparatus and adhered to the surface of the touch pad by way of vacuum suction. The testing apparatus provides a test rod traveling along a preset locus on the touch pad to take the output test value of the touch pad and input to the computer device such that the test value is compared with the preset value in the computer device to distinguish qualified touch pads from unqualified touch pads.
    Type: Application
    Filed: February 24, 2004
    Publication date: August 25, 2005
    Inventor: Hsing-Wu Li