Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.

Abstract: The heat dissipation structure of a horizontal optical-communication sub-assembly is provided, which includes a T-shaped header, a circuit board and a heat-dissipating support insert. The T-shaped header includes a base and a tongue. The tongue is disposed on one side of the base and is perpendicular to the base. The base includes a first through hole and a second through hole. The first through hole is above the tongue and the second through hole is below the tongue and opposite to the first through hole. One end of the circuit board penetrates through the first through hole and disposed on the tongue. The heat-dissipating support insert includes a supporting block and an extension portion. The extension portion is disposed on one side of the supporting block and penetrates through the second through hole to extend to the bottom of the tongue.

Abstract: An assembly of semiconductor and highly thermally conductive heat-dissipating substrates includes a thermally conductive metal substrate, a supporting substrate, and a vertical heat-dissipating block. The thermally conductive metal substrate comprises a substrate body, a receiving groove in the substrate body, and a thin-layer portion at a bottom side of the receiving groove. The supporting substrate is provided in the receiving groove. The two vertically opposite sides of the supporting substrate respectively form a carrying surface for carrying a laser diode LD and a heat-dissipating surface in contact with the thin-layer portion at the bottom side of the receiving groove. The vertical heat-dissipating block is provided on a side of the thermally conductive metal substrate opposing to a side with the receiving groove.

Abstract: The invention provides a heat-dissipating semiconductor assembly, comprising: a heat-dissipating substrate, a metal solder layer, and an edge emitting laser diode. The heat-dissipating substrate has one side formed with a flat surface for mounting the edge emitting laser diode. The edge emitting laser diode is mounted on the metal solder layer, and by lowering the active area of the edge emitting laser diode, the active area of the edge emitting laser diode is drawn close to one side of the heat-dissipating substrate. The edge emitting laser diode has an optical output direction parallel to the flat surface of the heat-dissipating substrate, and the heat-dissipating substrate and/or the metal solder layer have a groove. The ridge of the edge emitting laser diode is aligned with an opening formed in the groove of the heat-dissipating substrate, thereby preventing the heat-dissipating substrate and metal solder layer from contacting the ridge of the edge emitting laser diode.

Abstract: An optical communication module configured for enhancing optical coupling efficiency, which includes an optical butt joint receptacle and a light emitting body provided on one side of the optical butt joint receptacle. The optical butt joint receptacle has a receptacle body and a through hole provided in the receptacle body for a dual-core optical fiber to extend through. The receptacle body has a light-receiving side and an optical fiber insertion groove corresponding respectively to two ends of the through hole. The light emitting body includes a housing, a laser semiconductor provided in the housing, and an aperture provided in one side of the housing for aligning with the through hole so as that the laser beam emitted by the laser semiconductor is optically coupled to the dual-core optical fiber. The dual-core optical fiber has different core diameters and numerical apertures to enhance the coupling efficiency and reduce the coupling loss in between with the external optical fiber.

Abstract: An optical communication module configured for enhancing optical coupling efficiency, which includes an optical butt joint receptacle and a light emitting body provided on one side of the optical butt joint receptacle. The optical butt joint receptacle has a receptacle body and a through hole provided in the receptacle body for a dual-core optical fiber to extend through. The receptacle body has a light-receiving side and an optical fiber insertion groove corresponding respectively to two ends of the through hole. The light emitting body includes a housing, a laser semiconductor provided in the housing, and an aperture provided in one side of the housing for aligning with the through hole so as that the laser beam emitted by the laser semiconductor is optically coupled to the dual-core optical fiber. The dual-core optical fiber has different core diameters and numerical apertures to enhance the coupling efficiency and reduce the coupling loss in between with the external optical fiber.

Abstract: The present invention provides a composite heat-dissipating substrate structure, comprising: a heat-dissipating substrate and a heat-conducting metal layer. The heat-dissipating substrate includes a substrate body and a socket formed on the substrate body; and the heat-conducting metal layer widely covers the socket of the substrate body and have one side formed as a loaded side on which a laser semiconductor is to be mounted and a opposite side formed as a heat-dissipating side, so that after the loaded side absorbs heat from the laser semiconductor, the heat-dissipating side reverse to the heat-conducting metal layer diffuses the heat to the heat-dissipating substrate.

Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.

Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.

Abstract: A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.